Ngk Spark Plug Company, Limited

Ngk Spark Plug., Ltd.

Yasuhiro Sugimoto

Shinji Yuri

Kazuhiro Suzuki

Hajime Saiki

Yukihiro Kimura

Rokuro Kambe

Masao Kuroda

Makoto Origuchi

Tadahiko Kawabe

Manabu Sato

Kazuhiro Urashima

Kouki Ogawa

Kazunaga Higo

Tetsuya Kasiwagi

A circuit board ('&#x2033;) comprising: a board core () having a main core surface () and a rear core surface (); a ceramic capacitor (&#x2033;&#x2033;&#x2033;) having a main capacitor surface () and a rear capacitor surface (), having a structure in which a first inner electrode layer () and a second inner electrode layer () are alternately stacked with a ceramic dielectric layer () interposed therebetween, and having a plurality of capacitor function units () being electrically independent from each other, the ceramic capacitor (&#x2033;&#x2033;&#x2033;) being buried in the board core () in a state where the main core surface () and the main capacitor surface () are directed in a same direction; and a buildup layer () having a structure in which an interlayer insulating layer () and a conductor layer () are alternately stacked on the main core surface () and the main capacitor surface () and having a semiconductor integrated circuit device mounting region () for mounting a semiconductor integrated circuit device () having a plurality of processor cores () on a surface () of the buildup layer (), wherein the plurality of capacitor function units () are capable of being electrically connected to the plurality of processor cores (), respectively.

Ceramic capacitor

A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Wiring board

A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

Method for manufacturing wiring board

A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

Wiring board providing impedance matching

An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.

Intermediate substrate

An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.

A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board mounting the chip capacitors on a reverse face -side comprises bumps capable of being connected to IC chip first and second capacitor connecting pads connecting the upper face parts of the chip capacitors a plurality of insulating layers intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers in stripe pattern formed at interlayer connected to the bumps at the principal face -side, connected to the first capacitor connecting pads at the reverse face -side or the second capacitor connecting pads for changing the connecting positions or the connecting number between the principal face side and the reverse face side.

Growing community of inventors

Konan, Japan

Yasuhiro Sugimoto