Sony Chemicals Corporation

Yasuhiro Suga

Motohide Takeichi

A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes recessed from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechanical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer, even if the passivation layer is made of a resin. The connecting material ( ) is made up of an adhesive component ( ) of insulating property and electroconductive particles ( ), wherein each of the electroconductive particles ( ) is formed of a resin core particle ( ) coated with a metal layer ( ) and the average particle size d of the electroconductive particles ( ) is at least 1.5 times the recessed depth h of the electrodes ( ) from the outer face of the passivation layer ( ) of the semiconductor element ( ) and at most 0.5 time the distance s between the neighboring electrodes ( ).

Connecting material for anisotropically electroconductive connection

Anisotropically electroconductive adhesive material and connecting method

A light-blocking anisotorpically electroconductive adhesive film comprises electroconductive particles and a light-blocking material dispersed in an insulating adhesive agent. The light-blocking material is carbon, an inorganic filler, or a mixture of these.

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Kanuma, Japan

Yasuhiro Suga