Sony Corporation

Sony Chemical & Information Device Corporation

Other

Dexerials Corporation

Yasuhiro Suga

Takashi Matsumura

Noriyuki Honda

Kazunori Hamazaki

Shiyuki Kanisawa

Daisuke Sato

Noriaki Kudo

Hisashi Ando

Tohru Terasaki

Seiichi Miyachi

A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8&#xd7;10to 1&#xd7;10Pa&#xb7;s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film

A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2&#xd7;10to 1&#xd7;10Pa&#xb7;s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

Method of manufacturing semiconductor device

A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

Method for manufacturing semiconductor device

A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0&#xd7;10mPa&#xb7;s or more and 1.0&#xd7;10mPa&#xb7;s or less.

Device for mounting electric component

A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0&#xd7;10mPa&#xb7;s or more and 1.0&#xd7;10mPa&#xb7;s or less.

Method and device for mounting electric component

The present invention provides an electrical connecting member and an electrical connecting method for achieving electrical connection securely through conductive particles regardless of a slight unevenness of an object matter. An electrical connecting device ( ) for electrically connecting an electrical connecting portion ( ) of a first object to an electrical connecting portion ( ) of a second object comprises an adhesive layer ( ) disposed on the first object ( ) and constituted of a plurality of conductive particles ( ) and a binder ( ) containing the plurality of the conductive particles ( ) and a paste ( ) having a fluidity and disposed on the film-like adhesive layer ( ).

Electrical connecting device and electrical connecting method

An electrically connecting device and an electrical connecting method in which electrical connections can be positively realized via electrically conductive particles despite slight irregularities of objects to be eclectically connected to each other. The electrical connecting device electrically connects an electrically connection portion of the first object and the electrically connection portion of the second object. The electrical connecting device is made up of a first film-shaped adhesive layer and a second film-shaped adhesive layer . The first film-shaped adhesive layer , arranged on the first object , is made up of plural electrically conductive particles and a binder containing the electrically conductive particles . The second film-shaped adhesive layer , arranged on the first film-shaped adhesive layer containing the electrically conductive particles, is made up only of a fluid binder.

Electric connecting method and apparatus

An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (,) as a core material are dispersed in an insulating adhesive (,) to give an anisotropic electrically eonductive film. The resin (,) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 &angst;.

Growing community of inventors

Tochigi, Japan

Yasuhiro Suga