Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Yasuhiro Shiba

Yasuhiro Fukumoto

Toshihiro Nakajima

Mitsuhiro Masuda

Tatsuhisa Tsuji

Bingxi Liu

Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate that heats the substrate; lift pins that deliver the substrate, a lift pin drive mechanism that causes the lift pins to move upwardly/downwardly; a casing that produces a heat treatment atmosphere; and a cooling base plate that suppresses transmission of heat from the heat treating plate. The lift pin drive mechanism is disposed below the cooling base plate.

Substrate treating apparatus and substrate treating system including pin lift mechanism below cooling base and heat plate

Disclosed is a substrate treating apparatus with a baking unit for heating a substrate to which a treating liquid that generates sublimate through heating is applied to bake a surface of the substrate to form a coat film. The apparatus includes the following elements: a first bake group, a second bake group, a first exhaust pipe that forms a flow path of exhaust gases from the first bake group with its end being in fluid communication with an exhaust gas processor that processes the exhaust gases, a second exhaust pipe that forms a flow path of exhaust gases from the second bake group, and a junction provided at a midstream of the first exhaust pipe and in fluid communication with a downstream side of the second exhaust pipe.

Substrate treating apparatus and exhaust method thereof

A thermal processing unit is connected to a substrate position detector, which is in turn connected to a bake unit controller. The thermal processing unit includes a temperature control plate and a lifting device. The temperature control plate and lifting device are connected to the bake unit controller. The operations of the temperature control plate and lifting device are controlled by the bake unit controller. A pressure measuring pipe is provided at a lower part of at least one of a plurality of pin inserting holes in the temperature control plate. The pressure measuring pipe is connected to a low differential pressure sensor. The low differential pressure sensor detects the pressure in an airflow exhausted from a space surrounded by a substrate and an upper face of the temperature control plate via the pressure measuring pipe.

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Kyoto, Japan

Yasuhiro Shiba