Dic Corporation

Yamagata University

Yasuhiro Sente

Yoshinori Katayama

Tomoko Okamoto

Hiroshi Isozumi

Masayoshi Kotake

Yoshitomo Nagata

Tsutomu Kanno

Shin-ichi Ohara

Yutaka Hamasuna

Tadahiro Furukawa

Hideyuki Kobayashi

Norifumi Kawamura

Hideoki Iwanami

Takashi Tamaoka

Hideyasu Teramoto

Saori Yamaguchi

Ken-ichi Yatsugi

A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20° C. to 90° C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

Separation/recovery method for laminated film

A conductive ink composition for screen printing contains a conductive metal particle (A) having an oleic acid surfactant, a non-chlorine-based resin composition (B), and an organic solvent (C), wherein the conductive metal particle (A) is contained in an amount of 45 to 70% by weight with respect to the total ink composition, the non-chlorine-based resin composition (B) has a number average molecular weight of 50,000 or more and is contained in an amount of 5 to 15% by weight with respect to the total ink composition, the organic solvent (C) has a flash point of 75 to 110° C. and is contained in an amount of 25 to 50% by weight with respect to the total ink composition, and the ink composition has an ink viscosity of 10 to 25 Pa·s (23° C.) at a shear rate of 100 s.

Highly electrically conductive silver ink composition and wiring obtained using same

[Object] To provide a conductive ink composition which allows formation of a high resolution conductive pattern, and which can provide a high conductivity pattern by firing at a lower temperature and in a shorter time. [Solution] The aforementioned object is achieved by including a conductive filler, an epoxy compound, a blocked polyisocyanate in which a blocking agent is an active methylene compound and/or a pyrazole compound, a reaction catalyst for the blocked polyisocyanate, and an organic solvent as essential components. A conductive ink composition of the present invention can be fired at a lower temperature and in a shorter time and allows printing of a higher resolution conductive pattern.

Conductive ink composition, method for producing conductive patterns, and conductive circuit

Provided is an organic electroluminescent lighting device which can be seen that the entire surface is uniformly illuminated from the side of a transparent electrode substrate even when an auxiliary electrode or an auxiliary wiring is provided with respect to the transparent electrode substrate. In an organic electroluminescent lighting device including a pair of electrode layers including a translucent electrode layer provided on a translucent substrate, at least one organic layer interposed between the pair of electrode layers and including a light-emitting layer, and an auxiliary electrode provided on the translucent electrode layer such that the auxiliary electrode comes in contact with a portion of the translucent electrode layer, the auxiliary electrode includes conductive metal particles having a particle diameter of 0.1 to 2 &#x3bc;m, and is covered with an interlayer insulating coating film for suppressing the conduction with the organic layer.

Organic electroluminescent lighting device

A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50&#xb0; C. and has a boiling point of more than 300&#xb0; C. at normal pressure; an organic compound (C) that is liquid at 50&#xb0; C. and has a boiling point of more than 300&#xb0; C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170&#xb0; C. to 300&#xb0; C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

Conductive paste, method for forming conductive pattern, and object with printed conductive pattern

Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from the groove on the gravure plate to the blanket, and a step of transferring the printing paste from the blanket to a substrate. The groove on the gravure plate includes a region having a width of 100 to 700 &#x3bc;m in a direction perpendicular to a print direction. The region has a leading end tapered forward in the print direction and a trailing end split into a pair of branches by a notch tapered forward in the print direction.

Gravure offset printing method, gravure offset printing device, and gravure plate

The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25&#xb0; C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120&#xb0; C. or lower (low boiling point solvent), and the surface energy of the ink at 25&#xb0; C. is 10 to 21 mN/m.

Growing community of inventors

Sakura, Japan

Yasuhiro Sente