Canon Kabushiki Kaisha

Yasuhiro Sekine

Takeshi Ichikawa

Mineo Shimotsusa

Taro Kato

Genzo Momma

Mahito Shinohara

Masatsugu Itahashi

Shigeru Ichihara

Sho Suzuki

Masaki Kurihara

Yuki Yonetani

Shunsuke Nakatsuka

Mari Isobe

Hiroshi Mizuno

Shunsuke Inoue

Kyouhei Watanabe

Tetsuo Asaba

Yasushi Kawasumi

Nobuhiko Sato

Toshiki Ito

Hiroaki Sano

Kenji Makino

Yukihiro Hayakawa

Hideshi Kuwabara

Shigeru Nishimura

Yuzo Kataoka

Masataka Ito

Kentaro Suzuki

Hitoshi Shindo

Satoshi Hirayama

Takashi Arai

Akira Yamamoto

Masahiro Kobayashi

Takanori Watanabe

Yukio Hanyu

Akio Kashiwazaki

Shigeki Mori

Nobuhiro Yasui

Takeshi Kojima

Hiroshi Saito

Hajime Ikeda

Shigeyuki Matsumoto

Hiroshi Yuzurihara

Kazuaki Ohmi

Kanako Oshima

Kazunari Kawabata

Kei Fujita

Yutaka Akino

Mitsuhiro Yomori

Akira Ohtani

Yasuhiro Naruse

Hideo Genda

Seiji Kamei

Genzo Monma

Mariko Furuta

Jun Iwata

To achieve local melting of an inorganic material powder containing an inorganic material as a main component in an additive manufacturing technology, to thereby achieve high shaping accuracy. Provided is an inorganic material powder to be used in an additive manufacturing method involving performing shaping through irradiation with laser light, the inorganic material powder including: a base material that is an inorganic material; and an absorber, wherein the absorber has a higher light-absorbing ability than the base material for light having a wavelength included in the laser light, and contains any one of TiO, TiO, SiO, ZnO, antimony-doped tin oxide (ATO), and indium-doped tin oxide (ITO), or contains any one of a transition metal carbide, a transition metal nitride, SiN, AlN, a boride, and a silicide.

Inorganic material powder and method of manufacturing a structural body

A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate.

Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device

An identification apparatus includes a plurality of light collection optical systems configured to collect scattered light from a plurality of test substances, a spectroscopic element configured to disperse a plurality of light beams from the plurality of light collection optical systems, an imaging unit including a plurality of light receiving elements arrayed in a row direction and a column direction, and configured to receive a plurality of dispersion spectra projected from the spectroscopic element and projected in the row direction, an acquisition unit configured to acquire spectroscopic information of at least any of the plurality of test substances based on an output signal from the imaging unit, and an intensification processing unit configured to perform row direction binning processing including integrating output signals of the plurality of light receiving elements existing at different positions in the row direction.

Identification apparatus

A three dimensional manufactured product is manufactured A speed of filing an uncured light curing resin in a space for a next layer is enhanced, to improve a manufacturing speed. One surface of a container housing a light curing resin is configured by a gas-permeable sheet that faces the light curing resin, and transmits irradiation light of a light irradiating apparatus, and a light transmitting plate disposed at an outer side of the container from the gas permeable member. A pressurizing chamber controllable in pressure by a pressure controlling apparatus is defined between the gas-permeable sheet and the light transmitting plate. At moving a manufacturing stage, an inside of the pressurizing chamber is de-pressurized to cause the gas-permeable sheet to perform concave surface deformation, and at a time of performing light irradiation, gas in the pressurizing chamber is caused to permeate into the light curing resin by pressurizing.

Three dimensional manufacturing apparatus and method for manufacturing three dimensional manufactured product

An identification apparatus includes a plurality of collecting units configured to collect scattered light from a plurality of test items, a first spectroscopic unit configured to disperse light from part of the plurality of collecting units, a second spectroscopic unit configured to disperse light from a remaining part of the plurality of collecting units, an imaging unit configured to acquire a first spectrum projected from the first spectroscopic unit and a second spectrum projected from the second spectroscopic unit, the imaging unit including a plurality of light receiving elements arranged at least in a first direction, and an acquisition unit configured to acquire information about the test items based on an output signal from the imaging unit. One of a wavenumber of the first spectrum and a wavenumber of the second spectrum in the first direction increases while the other one decreases.

An identification apparatus includes: a plurality of light capturing units including light-capturing optical systems configured to capture a plurality of Raman scattered light fluxes from a sample, an optical fiber unit configured to include a plurality of optical fibers configured to respectively guide the captured Raman scattered light fluxes and in which the optical fibers are bundled at emission end portions thereof; a spectral element configured to disperse the guided Raman scattered light fluxes; an imaging unit configured to receive the dispersed Raman scattered light fluxes; and a data processor configured to acquire spectral data of the Raman scattered light fluxes from the imaging unit and configured to perform an identification process. The Raman scattered light fluxes dispersed by the spectral element are projected so that a spectral image formed on a light-receiving surface of the imaging unit extends along a main scanning direction of the imaging unit.

Identification apparatus and sorting system

There is provided a three-dimensional manufacturing apparatus which is characterized by comprising: a container configured to hold a liquid photocurable resin; a base configured to support a solid manufactured object obtained by curing the liquid photocurable resin; a moving unit configured to move the base; and a light source unit configured to irradiate light for curing the liquid photocurable resin. The container comprises a light transmission portion which is provided between the light source unit and the base, and is in contact with the liquid photocurable resin. The three-dimensional manufacturing apparatus further comprises a flow facilitating unit configured to facilitate a flow of the photocurable resin which is in contact with the light transmission portion, the flow being attended by the movement of the base.

Three-dimensional manufacturing apparatus, three-dimensional manufactured object producing method, and container for three-dimensional manufacturing apparatus

An identification apparatus identifies the kind of an object to be conveyed by a conveyor and includes an illumination optical system illuminating the object with light from a light source, a light capturing optical system capturing Raman-scattered light from the object, a spectral element dispersing the Raman-scattered light, a light-receiving element receiving the Raman-scattered light dispersed by the spectral element, and a data-processing unit acquiring spectral data of the Raman-scattered light from the light-receiving element and performs an identification process. An optical axis of the illumination optical system and an optical axis of the light capturing optical system intersect each other. The illumination optical system is an imaging optical system that has a numerical aperture for the conveyance surface smaller than that of the light capturing optical system for the conveyance surface, or a collimator optical system that converts the light from the light source into parallel light.

Identification apparatus, identification system, and resin-selecting system

An additive manufacturing apparatus in which a streak in a manufacturing direction is difficult to be made on the surface of a product manufactured object in a boundary region of projection regions of exposure images is provided. In this apparatus, a vessel holds a photosetting liquid resin material, a first projector makes a first exposure image incident from an incident surface and projects it into the resin material, a second projector makes a second exposure image, continuous with the first exposure image, incident from the incident surface and projects it into the resin material, and a controlling unit adjusts on a projection surface a boundary region between a first projection image obtained by projecting the first exposure image by the first projector and a second projection image obtained by projecting the second exposure image by the second projector.

Additive manufacturing apparatus

A manufacturing method of a solid state imaging device according to one embodiment includes the steps of forming, on a substrate, a gate electrode of a first transistor and a gate electrode of a second transistor adjacent to the first transistor; forming an insulator film covering the gate electrode of the first transistor and the gate electrode of the second transistor such that a void is formed between the gate electrode of the first transistor and the gate electrode of the second transistor; forming a film on the insulator film; and forming a light shielding member by removing a part of the film by an etching.

Solid state imaging device, manufacturing method of solid state imaging device, and imaging system

A method for manufacturing a solid-state image pickup apparatus includes forming a first insulating film over a substrate after forming a gate electrode of a first transfer transistor and a gate electrode of a second transfer transistor, forming a second insulating film on the first insulating film, forming a first structure and a second structure on side surfaces of the gate electrodes of the first and second transfer transistors, respectively, via the first insulating film by etching the second insulating film in such a manner that the first insulating film remains on a semiconductor region of a photoelectric conversion unit and a semiconductor region of a charge holding unit, and forming a light shielding film that covers the gate electrode of the first transfer transistor, the semiconductor region of the charge holding unit, and the gate electrode of the second transfer transistor.

Method for manufacturing solid-state image pickup apparatus, solid-state image pickup apparatus, and image pickup system including the same

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Yokohama, Japan

Yasuhiro Sekine