Sharp Kabushiki Kaisha Corporation

Yasuhiro Sakamoto

Shigeaki Kakiwaki

Hirotsugu Matoba

Yoshinori Nakajima

Tomoyuki Sagara

Tadashi Iwamatsu

Haruo Yamamoto

Hiroyuki Hirakawa

Hiroyuki Yamaji

Kaoru Higuchi

Kohji Shinkawa

Hitoshi Isono

Haruhiko Deguchi

Mai Takasaki

Shohei Komaru

Fumiaki Sugimori

Hiroshi Matsubara

Hidetsugu Kawai

Chiyoshi Yoshioka

The present invention provides a cell stimulation device capable of uniformly electrically stimulating cells intended to be electrically stimulated, and of preventing medium components from decomposing and depositing. [Solution] The cell stimulation device according to the present invention is intended to stimulate the cells being cultured in a culture medium, and is characterized in that the cell stimulation device includes an electron emission element for feeding electric charges to the culture medium via a gas phase, and an electric charge collecting electrode for collecting the electric charges from the culture medium, the electron emission element includes a lower electrode, a surface electrode, and an intermediate layer disposed between the lower electrode and the surface electrode, and the electric charge collecting electrode is disposed so as to be contactable with the culture medium.

Cell stimulation device, cell culture device, and cell stimulation method

A nozzle plate () of the present invention is arranged such that, between (i) a first nozzle layer () having a first nozzle hole (orifice) () that discharges a liquid substance and (ii) a second nozzle layer () having a second nozzle hole () that is connected to the first nozzle hole () and receives the liquid substance, a blocking layer () having a higher resistance to etching than the first nozzle layer () is provided. In this nozzle plate (), the blocking layer () is locally formed around a connecting part at which the first nozzle hole () is connected to the second nozzle hole (). On account of this, the first nozzle hole of the nozzle plate is highly precisely formed, and the deformation of the nozzle plate, e.g. warpage, hardly occurs.

Nozzle plate and method of manufacturing the same

An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit board(s); actuator member(s) electrode(s) for connection to external circuitry being formed in or on floor(s) of recess(es) which is/are step(s) smaller in magnitude than thickness(es) of outer lead(s) protruding from polyimide substrate(s) of TCP(s); adhesive(s) having thickness(es) more or less equal to difference(s) between step(s) and thickness(es) of outer lead(s); and outer lead(s) being electrically and mechanically connected to electrode(s) for connection to external circuitry.

Circuit board electrode connection structure

There are provided driving electrodes () on walls () separating both sides of individual ink chambers () formed in the form of an array of multiple grooves. External circuit connecting electrodes () for connecting these driving electrodes () to an external circuit are formed on exposed surface regions of electrically conductive material () filled in the individual ink chambers () at a rear end portion of a head. Each of the aforesaid exposed surface regions has an area larger than the cross-sectional area of each ink chamber as measured along a direction perpendicular to the ink chamber array.

Inkjet head with formed external circuit connecting electrodes

In a droplet spray apparatus spraying out ink from an ink path by altering the volume of an ink channel formed in a trench that is covered with a cover plate and that has a conductive member provided at one end formed at a piezoelectric member, an ink supply opening to supply ink is provided at the end side where the conductive member is provided. Accordingly, an ink jet head that can be made compact, fabricated easily, and superior in productivity is obtained.

Ink jet head with partially exposed inside electrode and fabrication method thereof

A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads of a TCP device. Part of a soldered portion of outer leads that is located closer to a semiconductor chip of the TCP device is reinforced by a support ring formed on a side of the outer leads opposite from a circuit board, so that a stress to be exerted on the outer leads is dispersed to the leads, the support ring and solder to thereby prevent the possible occurrence of metal fatigue of the leads.

Device assembly structure with reinforced outer leads

Growing community of inventors

Matsubara, Japan

Yasuhiro Sakamoto