Toshiba Medical Systems Corporation

Kabushiki Kaisha Toshiba

Canon Medical Systems Corporation

Canon Medical Svstems Corporation

Yasuhiro Ona

Hiroyuki Shikata

Satoru Tezuka

Takashi Takeuchi

Takashi Kubota

Kengo Okada

Takeshi Miyagi

Fumiyasu Sakaguchi

Yasuhisa Makita

Koichi Shibamoto

Minoru Aoki

Yusuke Kobayashi

Tomohiro Sato

Satoru Asagiri

Michiko Oishi

According to one embodiment, an ultrasonic probe includes a plurality of ultrasonic transducers, an electronic circuit, an insulative heat conductive spacer and an electrical heat supporting element. The electronic circuit is electrically connected to a plurality of transducers on one side. The insulative heat conductive spacer contacts with another side of the electronic circuit. The electrical heat supporting element has a contact region that makes contact, in a first surface, with the insulative heat conductive spacer, and a supporting structure that supports the insulative heat conductive spacer to have a predetermined thickness, and diffuses heat generated by the electronic circuit from the contact region.

Ultrasonic probe

An ultrasonic probe includes an ultrasonic transducer array and a multilayer body for extracting an electric wiring from each electrode. Transducers are classified into at least a first group and a second group. The multilayer body includes a first FPC layer on which the array is stacked and a second FPC layer on which the first FPC layer is stacked. The first FPC layer and the second FPC layer include upper surface connection pads and lower surface electrode pads which maintain a uniform level at positions spatially corresponding to the respective transducers. FPC layers constituting an FPC multilayer body are bonded to each other to be integrally formed in a region corresponding to the width of the array. On the other hand, the respective FPC layers are not bonded to each other and separated from each other outside the region corresponding to the width of the array.

According to one embodiment, an ultrasonic probe includes piezoelectric elements, a flexible printed circuit, and one of an air gap layer and a resin layer. The piezoelectric elements transmit and receive ultrasonic waves. The flexible printed circuit located on a rear surface side of the piezoelectric elements and electrically connected to the piezoelectric elements. The air gap layer locates on a rear surface side of the flexible printed circuit and has air gaps. The resin layer is obtained by filling the air gap layer with a resin and locates on the rear surface side of the flexible printed circuit.

An ultrasound transducer includes an electric vibrator including a vibrator contact layer, to transmit and receive ultrasound wave, and a circuit-board including a circuit contact layer connected to the vibrator contact layer, to transmit and receive ultrasound signals via the vibrator contact layer. A maximum width which width is an extent of a shorter side of the circuit contact layer, is same to a width of the electric vibrator. The circuit contact layer includes a bonding area that extends to a surface of a circuit-board and a surface of the vibrator contact layer. An adhesive is provided in the bonding area to adhere the electric vibrator and the circuit-board to each other.

Ultrasound probe

The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves.

Ultrasonic transducer, manufacturing method thereof, and ultrasonic probe

According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer.

Ultrasonic probe and method of manufacturing the same

A base has a plurality of projections or recesses. Each of the projections or recesses corresponds to one channel of vibration elements. Each of the vibration elements has a plurality of MUT elements. Each of the MUT elements transmits and receives ultrasonic waves. A plurality of MUT elements are arranged in each of the projections or recesses. Consequently, each of the vibration elements can transmit and receive ultrasonic waves having radiation surfaces curved along the surfaces of the projections or recesses.

Growing community of inventors

Nasushiobara, Japan

Yasuhiro Ona