Other

Kabushiki Kaisha Kobe Seiko Sho

Sun Aluminium Industries, Ltd.

Yasuhiro Okamura

Eiichiro Yoshikawa

Naoya Fujiwara

Hiroshi Kawai

Mikio Ono

The present invention provides a resin-coated metal plate suitable as a cover plate for use in perforating a printed-wiring board with a drill, capable of effectively preventing the heat generation of drill bits and the scattering of chips while sufficiently performing lubrication and discharging the chips, to highly efficiently form a high-quality perforated-hole with excellent smoothness of the inner wall thereof while reducing the risk of breakage of the drill and eliminating any surface tackiness to achieve excellent operating performance and storage stability. The resin-coated metal plate of the present invention comprising a metal base plate, and a film made of a thermoplastic resin and formed on at least one of the opposite surfaces of said metal base plate to cover thereover, said thermoplastic resin being substantially water-insoluble, wherein said thermoplastic resin has: a melting peak temperature measured according to JIS K7121 ranging from 60&#xb0; C. to 120&#xb0; C.; a melt viscosity ranging from 1&#xd7;10P to 1&#xd7;10P under a shear rate of 200 mm/sec, and from 5&#xd7;10P to 5&#xd7;10P under a shear rate of 3000 mm/sec, in the state when said thermoplastic resin is molten at 150&#xb0; C.; and a durometer D hardness measured according to JIS K7215 ranging from 20 to 45.

Resin-coated metal plate for use in perforating printed-wiring board

A metal plate coated with a lubricating resin is coated with a lubricating resin having a modified polyamide ({circle around (1)}) and a crosslinking curing agent ({circle around (2)}) of the modified polyamide ({circle around (1)}) on at least one side face of the metal plate. At this time, the compounding ratio of the modified polyamide ({circle around (1)}) and the above-described crosslinking curing agent ({circle around (2)}) is preferably (60:40) to (15:85) by mass ratio converted to solid content. Furthermore, according to requirement, an inorganic powder filler ({circle around (3)}) may be added to the resin composition.

Metal plate coated with lubricating resin and drilling processing method of printed wiring board use thereof

Growing community of inventors

Narashino, Japan

Yasuhiro Okamura