Sumitomo Electric Industries, Limited

Makino Milling Machine Company, Ltd

Okayama University

Yasuhiro Okamoto

Motoki Kakui

Shinobu Tamaoki

Hiroshi Kohda

Yasuomi Kaneuchi

Shigehiro Nagano

Haruya Kurihara

Yoshiyuki Uno

Kenta Takahashi

The object of the present invention is to make it possible to maintain a stable electric discharge and to achieve a stable quality and machining performance even when a work having a non-uniform composition is machined. A wire electric discharge machining device performs electric discharge machining on a work while controlling an inter-electrode distance between a wire and the work based on an inter-electrode voltage between the wire and the work so as to match a set target voltage. The wire electric discharge machining device includes an inter-electrode voltage measuring unit that measures the inter-electrode voltage, an actual amplitude calculating unit that calculates an amplitude of the measured inter-electrode voltage, and a target voltage correcting unit that corrects the target voltage in such a way that the calculated amplitude approaches the target amplitude that is set to a value larger than zero.

Wire electric discharge machining device, and control method and control program therefor

There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.

Laser processing method

Growing community of inventors

Okayama, Japan

Yasuhiro Okamoto