Texas Instruments Corporation

Yasuhiro Ochiai

Kiyokazu Ikeya

Hideyuki Takahashi

Toyokazu Ezura

Yasushi Hibino

A socket (,) includes a body (,) and a cover (,). Body (,) has a base (,) having a horizontally movable slide (,) thereon on which a BGA package can be mounted and a plurality of contact members (,) arranged on base (,) corresponding to a pattern of solder balls of the BGA package. Each of contact members (,) has a pair of spring arms (,) which can be opened and closed in response to movement of slide (,). In one embodiment, a cover (,) is vertically movable relative to body (,). The cover (,) has motion transfer portions (,) having a wedge shape which are engageable with tapered force receiving portions (,) of slide(,). As cover (,) is pushed down, engagement surfaces (,) of motion transfer portions (,) engage force receiving surfaces (,) of slide (,) and slide (,) moves so that arms (,) of contact members (,) are opened. In another embodiment, the motion transfer parts (,) are provided on a head (,) which has an air suction holder for a BGA package.

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Tokyo, Japan

Yasuhiro Ochiai