Matsushita Electric Industrial Co., Ltd.

Yasuhiro Noma

Satoshi Shida

Shinji Kanayama

Shinjiro Tsuji

Yasutaka Tsuboi

Shuichi Hirata

Masahiko Ikeya

Shunji Onobori

Ryoichiro Katano

Akira Kugihara

Akimitsu Mukai

A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate discharge holder, and then while the substrate discharge holder is not moved, the substrate holding-and-moving device is moved to another substrate position, where a new substrate is received. Consequently, a later-executed movement operation for moving the new substrate to a substrate mounting region by the substrate holding-and-moving device, and a transfer operation for transferring the component-mounted substrate to an unloader unit by the substrate discharge holder, may be performed in parallel with each other without being influenced by each other's operation.

Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation

A component-mounting apparatus is provided with a pallet-carrying unit that carries a pallet, holding boards, within the apparatus. The pallet-carrying unit carries the pallet to a loading unit for feeding boards to the pallet, an ACF applying unit for applying an ACF tape onto the boards, a pre-press bonding unit for positioning components relative to the boards and bonding the components with a first pressing force, a final bonding unit for bonding the components to the boards with a second pressing force larger than the first pressing force so as to fix the components onto the boards, and an unloading unit for removing the boards, with the components mounted thereon, from the pallet. Then, the pallet-carrying unit returns the pallet from the unloading unit to the loading unit.

Component mounting apparatus and component mounting method

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Yao, Japan

Yasuhiro Noma