Futaba Corporation

Seiko Instruments Inc

Futaba Denshi Kogyo K.k.

Yasuhiro Nohara

Yoshihisa Yonezawa

Hiroaki Kawasaki

Yukio Ogawa

Masayoshi Shiraishi

Kiyoshi Aratake

Hisashi Nakata

Yoshikazu Iidaka

Toshiharu Tanaka

A pin having a light guide for an injection mold includes an outer sleeve having a hollow portion, an inner sleeve fixed to the hollow portion of the outer sleeve, a bundle sleeve fixed to a hollow portion of the inner sleeve, a bundle fiber fixed to a hollow portion of the bundle sleeve. A leading end portion of the bundle sleeve has a substantially cone-shaped caulked portion. A portion of the hollow portion of the inner sleeve which is brought into contact with the cone-shaped caulked portion of the bundle sleeve has a tapered shape that coincides with the shape of the portion of the bundle sleeve. A shoulder portion is formed at a rear end portion of the hollow portion of the outer sleeve and a rear end of the inner sleeve is engage with the shoulder portion.

Pin having light guide for injection mold

In a fluorescent display tube, a metal spacer is used as a height sustaining member and a fixing member of linear member so that the fixing strength of the linear member in the lengthwise direction is increased. In the fluorescent display tube, both ends of filament and Al wires are bonded onto a cathode electrode formed on a substrate by ultrasonic bonding. The ends of the filament are embedded in a part in the Al wires in the shape of being bent into a letter Z or an inverted letter Z to form fixing portion.

Electron tube with stepped fixing portion

A fluorescent display tube is disclosed. In the fluorescent display tube, linear members, such as, for example, wire grids and filament are sustained in a predetermined height, while both ends of each linear member are welded on a metal layer by ultrasonic. The fluorescent display tube includes a metal spacer for fixing the linear member and holding the linear members in an elevated position so that the dead space within the fluorescent display is reduced. The linear members are bonded on an aluminum thin films formed on the glass substrateby way of the aluminum spacer. The aluminum spacer sustains the linear members in a predetermined height. Aluminum spacer acts as a member for fixing the linear member and as a height level holding member.

Electron tube having linear members

An electron tube includes a vessel, a primary linear member installed in the vessel, an electrode disposed in the vessel, a first auxiliary linear member and a second auxiliary linear member disposed at different heights to interpose the primary linear member therebetween, and a plurality of fixing members. The fixing members are formed at a single substrate for constituting a part of the vessel, for fixing end portions of the first auxiliary and the second auxiliary linear member thereto.

Electron tube having linear damper

An electron tube includes at least one metal film formed on a base, at least one linear member provided above the base, and at least one additional member for connecting said at least one linear member to said at least one metal film. The at least one linear member is connected to the at least one metal film by welding the at least one additional member to the at least one metal film.

Electron tube and method for producing the same

An electron tube such as a fluorescent display tube is provided. Auxiliary linear support members (e.g. linear spacers and linear dampers), which subsidiarily support liner members (e.g. cathode filaments and wire grids), are bonded on a substrate, using ultrasonic welding (without using an adhesive agent (e.g. fritted glass or a conductive paste)). A metal layer (e.g. a thin or thick aluminum film) is formed over the glass substrate. The end of the coil of a cathode filament is securely bonded to the metal layer. A spacer of a metal wire (e.g. aluminum) is ultrasonic welded to the metal layer. The welding is performed with the wedge tool of an ultrasonic welder placed at the position where the spacer is in contact with the cathode filament. A U-shaped recess is left at the welded spot. This recess prevents the cathode filament from being displaced. If necessary, the metal layer is formed over the substrate and the damper of a metal wire (e.g. aluminum) is disposed to prevent the vibration of the cathode filament.

Electron tube and method of manufacturing the same

A method is provided for fabricating a piezoelectric vibrator without degrading vibration characteristics. The piezoelectric vibrator has a vibration plate formed with a piezoelectric vibration portion and a frame portion integrally connected with a base portion of the piezoelectric vibration portion and surrounding the piezoelectric vibration portion. Opposite surfaces of the piezoelectric vibration plate are provided with a pair of lid members bonded to hermetically seal the piezoelectric vibration portion without interfering with vibration thereof. To achieve the bonding, a metal film is coated over substantially the entire area of opposite surfaces of the piezoelectric vibration plate. The metal film is patterned to form oscillation electrode films on opposite surfaces of the piezoelectric vibration portion and to form bonding films on opposite surfaces of the frame portion for bonding the frame portion to the pair of lid members.

Method for manufacturing piezoelectric oscillator

To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member having a bonding film on a bonding surface and a second member closely put on the bonding surface of the first member through the bonding film in a manner that the first member is rendered as an anode, characterized in that: the bonding film is of a metal film and the second member is of a soda-lime glass, and a bonding temperature is at 100-200&deg; C. and an application voltage is at 0.5-5.0 kV.

Method for anodic bonding

A fluorescent display device capable of realizing mounting of a semiconductor element on a substrate while ensuring an increase in moisture resistance, a decrease in contact resistance at connection between the semiconductor element and a wiring conductor and increased reliability. A semiconductor element is mounted on an extension of a substrate and received in a mounting chamber formed by cooperation of a sealing material, a face plate and the substrate. The semiconductor element is downwardly pressed against the substrate by the face plate, resulting in the semiconductor element being electrically connected to a wiring conductor. The sealing material is made of an inorganic material such as indium-tin alloy or the like which has an operating temperature lower than a sealing medium.

Growing community of inventors

Chiba, Japan

Yasuhiro Nohara