Murata Manufacturing Co., Ltd.

Yasuhiro Nishisaka

Yukio Sanada

Koji Sato

Mitsuru Ikeda

Tetsuya Kisumi

Makoto Ogawa

Masato Kimura

Satoshi Matsuno

Yoko Okabe

Seiichi Matsumoto

Kosuke Onishi

Yoshito Saito

Toshiki Nagamoto

Akira Ishizuka

Takehisa Sasabayashi

Akihiro Yoshida

Satoshi Muramatsu

Tomohiro Sasaki

Kotaro Shimizu

Kazuki Yoshino

Masaki Hirota

Shinji Otani

Akito Mori

Takefumi Takahashi

Tomotaka Hirata

Seiji Koga

Akihiro Tsuru

Tatsuya Izumi

Shinya Isota

Yasunori Taseda

Tomochika Miyazaki

Syouta Ikebe

Tomoe Tanaka

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Electronic component

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 &#x3bc;m. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

A multilayer ceramic electronic component includes a multilayer body and an outer electrode on each end surfaces of the multilayer body. The outer electrode includes an underlying electrode layer and a plating layer on the underlying electrode layer. Void portions inside the underlying electrode layer are each filled with a barrier film. The barrier film is formed by an atomic layer deposition method.

Multilayer ceramic electronic component and method for manufacturing the same

An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction. The internal nickel electrode layers are exposed at the end surfaces. External nickel layers are provided on the end surfaces. External copper electrode layers cover the end surfaces on which the external nickel layers are provided. A deviation amount in the width direction between positions of ends of two adjacent internal nickel electrode layers on both side surfaces is at least about 0.5 &#x3bc;m. The external nickel layers are provided on the end surface, in a region excluding a rounded ridge portion. Nickel and tin layers are provided outside the external copper electrode layer.

An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2&#x2264;Tea/Tem&#x2264;about 1.1 is satisfied.

Electronic component and method of manufacturing the electronic component

An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T, a relationship of TN&#x3c;Tis satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W, a relationship of WN&#x3c;Wis satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.

Electronic component including diffusion regions

An electronic component includes external nickel layers each provided on end surfaces of a multilayer body and external copper electrode layers each covering the end surfaces on which the external nickel layers are provided. When a dimension of each of the external nickel layers in the lamination direction is defined as TN, and a dimension of the inner layer portion in the lamination direction is defined as T1, T1&#x3c;TN is satisfied. When a dimension of each of the external nickel layers in the width direction is defined as WN and a dimension of the inner layer portion in the width direction is defined as W1, a relationship of WN&#x3c;W1 is satisfied, and a relationship of WN&#x3c;TN is satisfied. The inner layer portion includes at least one uncovered region. The internal and external nickel electrode layers are directly bonded in the uncovered region.

An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2&#xd7;10atoms/cm.

An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800&#xb0; C. to about 1,100&#xb0; C. during the firing is about 15&#xb0; C. per minute or more.

Method for manufacturing multilayer ceramic capacitor

A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 &#x3bc;m and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.

Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode

A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

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Nagaokakyo, Japan

Yasuhiro Nishisaka