Matsushita Electric Industrial Co., Ltd.

Yasuhiro Narikiyo

Takatoshi Ishikawa

Kazuhiko Noda

Hitoshi Mukojima

Akira Nishimura

Osamu Uchida

Toshiro Hirakawa

Hiromi Kanaki

Hitoshi Mukohjima

An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Electronic component placement machine having camera units with vertically overlaid apertures

In a component pressing head which holds a component with a component holding tool provided at one end of a shaft member, rotates the component around an axis of the shaft member and presses the component in an axial direction of the axis, a first voice coil motor and a second voice coil motor are disposed between a upper plate and a lower plate so as to sandwich the shaft member from opposite sides thereof, so that a load is transmitted to the shaft member from the lower plate that is coupled to movable magnet holding portions of these two voice coil motors.

Component pressing device

Electronic component placement method

Growing community of inventors

Fukuoka, Japan

Yasuhiro Narikiyo