Matsushita Electric Industrial Co., Ltd.

Sekisui Chemical Co., Ltd.

Yasuhiro Nakatani

Takashi Watanabe

Fumio Echigo

Tadashi Nakamura

Daizo Andoh

Hideki Higashitani

Yoji Ueda

Shunsaku Muraoka

Yoshihiro Bessho

Takeshi Suzuki

Satoru Tomekawa

Tatsuo Ogawa

Tousaku Nishiyama

Shozo Ochi

Akinaga Natsui

Susumu Matsuoka

Noritake Fukuda

Hiroji Fukui

Shoji Nozato

Akihiko Fujiwara

Katsunori Takahashi

Ren-de Sun

Akihiro Niki

Motokuni Ichitani

Hirotake Matsumoto

Kazuhiro Kawabata

Takeo Kuroda

Takahiro Oomura

Ren-De Sun

Provided are a surface treated phosphor having high dispersibility and remarkably improved moisture resistance without degradation in fluorescence properties, and a method of producing the surface treated phosphor. The present invention relates to a surface treated phosphor including: a phosphor matrix including an alkaline earth metal and silicon; and a surface treatment layer including an alkaline earth metal, silicon, and a specific element belonging to groups 4 to 6 of the periodic table, wherein, when element distribution of the surface treatment layer in the thickness direction viewed in cross-section is determined by electron microscopy and energy dispersive X-ray spectroscopy coupled with the electron microscopy, the position representing the maximum peak of a specific element content is located closer to the surface than the position representing the maximum peak of a silicon content and silicon contents of the phosphor matrix and the surface treatment layer satisfy the following formula (1):[Formula 1]S&#x3c;S&#x2003;&#x2003;(1)

Surface-treated fluorescent material and process for producing surface-treated fluorescent material

This invention provides a photoreactive composition in which reaction of a hydrolyzable metal compound takes place by irradiation of light. A photoreactive composition, which comprises a hydrolyzable metal compound (A) comprising a metal atom and a hydrolyzable functional group bonded to the metal atom and, a compound (B) promoting reaction, polymerization or crosslinking of the compound (A) in the presence of oxygen by irradiation of light.

Photoreactive composition

The present provides a method for preparing resin fine particles of a homogeneous particle size used in the fields of chemistry, medicine, electronic material or the like, resin fine particles, and a production apparatus for resin fine particles. The present invention provides a method for preparing a resin fine particle, which comprises discharging a liquid comprising a polymerizable monomer as a dispersion phase into a continuous phase; splitting the liquid comprising the polymerizable monomer by applying mechanical vibration to form a liquid droplet; and polymerizing the liquid droplet in a state without splitting or integrating the liquid droplet, said method comprising recognizing a state of said liquid being split into a liquid droplet, and a condition of said discharging and/or said mechanical vibration of the liquid being determined by feedback from a result of the recognition.

Method for preparing resin particles, resin particles and apparatus for preparing resin particles

The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

Method for manufacturing printed circuit board

It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.

Multilayer circuit board and method for manufacturing the same

The present invention presents a thermoplastic elastomer that exhibits superior moisture permeability, excellent flexibility and mechanical properties at a high temperature, particularly settling resistance at a high temperature, and excellent moisture permeability. The thermoplastic elastomer includes, as a constituting unit, a polyether component (A) and a polyester component (B), wherein the polyether component (A) includes poly-oxyalkylene groups (&#x2014;CHO&#x2014;) having a carbon/oxygen atomic ratio in a range from 2.0 to 2.5, the polyester component (B) has a number-average molecular weight in a range from 500 to 10,000, the thermoplastic elastomer has a content of polyether component (A) in a range from 50 to 95 weight %, and the thermoplastic elastomer has a glass transition temperature of not more than &#x2212;20&#xb0; C.

Thermoplastic elastomer, use thereof, and process for producing the same

The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

Printed circuit board and method of manufacturing the same

Removable mask films are formed on the both sides of the substrate having the adhesive layer by applying and drying a resin varnish including a ultraviolet-absorbing agent, and fine through holes are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board

A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

Method of producing a circuit board

Circuit board and production of the same

A ring-type magnetic head is of a structure in which a metallic magnetic film is sandwiched between two substrates, and the metallic magnetic film has a saturation magnetic field not less than 50 A/m in all directions parallel to a film plane thereof. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx greater than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not less than Tc and a second heat treatment at a temperature Ta of Tc-180.degree. C..ltoreq.Ta.ltoreq.Tc-30.degree. C. in the absence of any applied magnetic field. Where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx less than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not greater than Tx while a rotating magnetic field is being applied thereto and a second heat treatment at a temperature Ta of Tx-200.degree. C..ltoreq.Ta.ltoreq.Tx-50.degree. C. in the absence of any applied magnetic field.

Magnetic head and method of making same

A ring-type magnetic head is of a structure in which a metallic magnetic film is sandwiched between two substrates, and the metallic magnetic film has a saturation magnetic field not less than 50 A/m in all directions parallel to a film plane thereof; the direction of lamination of the sandwich is generally perpendicular to a gap-forming surface of the head; where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx greater than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not less than Tc and a second heat treatment at a temperature Ta of Tc-180.degree. C..ltoreq.Ta.ltoreq.Tc-30.degree. C. in the absence of any applied magnetic field; where the metallic magnetic film is a Co-containing magnetically soft film having a crystallization temperature Tx less than the Curie temperature Tc, the metallic magnetic film is subjected to a first heat treatment at a temperature not greater than Tx while a rotating magnetic field is being applied thereto and a second heat treatment at a temperature Ta of Tx-200.degree. C..ltoreq.Ta.ltoreq.Tx-50.degree. C. in the absence of any applied magnetic field.

Growing community of inventors

Osaka, Japan

Yasuhiro Nakatani