Sumitomo Bakelite Company Limited

Nippon Steel Sumitomo Metal Corporation

Yasuhiro Mizuno

Chihiro Uematsu

Naoki Tajima

Tatsuro Honda

Yoichi Inoue

Kazuya Shigeno

A main object of the present invention is to provide a method capable of measuring surface temperatures of a plurality of points of cast slab at a secondary cooling zone of a continuous caster with a good accuracy and at low cost. The method comprises the steps of inserting one end of a plurality of optical fibersrespectively to nozzlesand tubes, and installing each nozzle between support rolls that support the cast slab, while spraying purge air from each nozzle toward a surface of the cast slab, receiving a thermal radiation light from the cast slab at the one end of each optical fiber, gathering other ends of the optical fibersin a bundle to take images including a core image of the other end of each optical fibers by an imaging means, and calculating the surface temperature of the cast slab.

Method and apparatus for measuring surface temperature of cast slab

Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 &#x3bc;m is not more than 5% by mass.

Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device

An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Epoxy resin composition and semiconductor device

Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN

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Tokyo, Japan

Yasuhiro Mizuno