Dainippon Screen Mfg. Co., Ltd.

Dainippon Screen Mfg. Co., Ltd. Corp. of Japan

Yasuhiro Mizohata

Minobu Matsunaga

Hideaki Matsubara

Yoshihiro Koyama

Takeshi Yane

Masahiro Miyagi

Ryuichi Hayama

A pressure sensor comprises a thin disk-shaped diaphragm, a laser displacement meter for detecting an amount of deformation of the diaphragm, and an operation part connected to the laser displacement meter. In the pressure sensor, an amount of deformation of the diaphragm due to pressure of fluid flowing into the pressure sensor is detected by the laser displacement meter, and pressure of the fluid is obtained on the basis of the amount of deformation and conversion information stored in the operation part in advance. The base part of the diaphragm of the pressure sensor is made of graphite (or silicon substrate), and a thin film of silicon carbide which is in contact with fluid is formed on a surface of the base part. This improves chemical resistance to the pressure sensor and extends the lifetime of the pressure sensor while preventing metal elution.

Pressure sensor and substrate processing apparatus

A substrate processing apparatus for processing a substrate while transferring the substrate among a plurality of units with which the substrate is to be processed or on which the substrate is to be placed. This apparatus is provided with: a first unit group disposed along a linear first line; a second unit group disposed along a linear second line crossing the first line at a predetermined angle; and a transfer robot capable of transferring and receiving a substrate to and from the first unit group and the second unit group.

Substrate processing apparatus and substrate processing method

A differential pressure flowmeter comprises a tube having a circular section, a first pressure sensor for measuring a pressure of a liquid flowing into the tube, a second pressure sensor for measuring a pressure of a liquid flowing out of the tube, a storage part for storing information and an operation part for performing various computations. In the differential pressure flowmeter, a laminar flow where a Reynolds number is less than or equal to 2000 is formed within the tube. Outputs from the first pressure sensor and the second pressure sensor are transmitted to the operation part, a pressure difference between both ends of the tube is obtained, and then a flowrate of a liquid flowing through the tube is determined on the basis of the pressure difference and flowrate information stored in the storage part in advance. In the differential pressure flowmeter, after the flow is made laminar completely, the pressure difference is obtained and it is thereby possible to perform measurement of the flowrate stably with high accuracy.

Differential pressure flowmeter, flow controller, and apparatus for processing substrate

A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use; and an undiluted replacement liquid supplying section for supplying an undiluted replacement liquid as a source of the replacement liquid into the buffer container. Copper mesh members each prepared by weaving a copper wire, straight copper pipes or copper plates are accommodated as a copper source in each of the copper dissolution tanks. The copper dissolution tanks each include a detachable cartridge, in which the copper mesh members or the like are disposed.

Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method

A plating apparatus for performing a plating process for plating a surface of a substrate. This plating apparatus is provided with a first electrode to be brought into contact with a peripheral edge portion of the substrate; a plating vessel for containing a plating liquid to be brought into contact with the surface of the substrate, the plating vessel having a vertical tubular interior surface; a second electrode disposed in the plating vessel, the second electrode being spaced from the substrate by a distance which is not smaller than a distance between a center portion and a peripheral edge portion of the substrate during the plating process; and an electric current limiting member for limiting horizontal flow of an electric current in the plating liquid between the second electrode and the substrate within the plating vessel during the plating process.

Plating apparatus and plating method

A plating apparatus () provided with: a plating vessel (to) having a cylindrical side wall () for containing a plating liquid; a substrate holding mechanism (to) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring () provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode () to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism () for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.

Plating apparatus, plating cup and cathode ring

A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an accelerator, a retarder and chlorine) of a plating liquid being used in the plating unit, an enclosure which houses therein a substrate treating section including the plating unit, the cleaning unit and the substrate transport mechanism, and a system controller for controlling the entire apparatus.

In a substrate cooling apparatus for cooling a substrate placed on or adjacent a cooling plate having Peltier elements, the substrate is cooled quickly by controlling the Peltier elements to cool the cooling plate to a second set temperature below a target temperature to which the substrate is to be cooled, and switching control of the Peltier elements at a predetermined time after the substrate is placed on or adjacent the cooling plate, to increase the temperature of the cooling plate to the target temperature. Alternatively, the substrate may be cooled quickly by controlling the Peltier elements to cool the cooling plate to a predetermined temperature, controlling the Peltier elements at a normalized maximum cooling output when the substrate is placed on or adjacent the cooling plate, determining, when the cooling plate reaches a peak of temperature increase, a lower limit temperature related to the peak of temperature increase, and switching control of the Peltier elements, when the cooling plate reaches the lower limit temperature, to bring the cooling plate to the target temperature.

Substrate cooling method and apparatus

A treating chamber includes a cooling plate assembly for supporting and cooling a substrate and an auxiliary cooling plate disposed on or adjacent a ceiling of the treating chamber. The auxiliary cooling plate reduces an atmospheric temperature in a space above the substrate supported on the cooling plate assembly to a target temperature to which the substrate is to be cooled by the cooling plate assembly. Consequently, the substrate having undergone a high temperature treatment is cooled quickly to the target temperature, and improved uniformity of temperature distribution is secured over a substrate surface after the cooling step.

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Kyoto, Japan

Yasuhiro Mizohata