Nippon Electric Glass Co., Ltd.

Lg Display Co., Ltd.

Git Japan, Inc.

Yasuhiro Matsumoto

Yasuo Teranishi

Takaya Furuta

Michiharu Eta

Taiki Minari

Takahide Fujii

Koichi Mori

Naotoshi Inayama

Hiroki Mori

JaeYoung Oh

GiSang Hong

Akio Nakabayashi

Koji Nishijima

Hiroshi Naruse

EunJin Bae

ByeongKeun Kim

YoungKwang Park

KangHoon Lee

HyooKyung Choi

Naohiko Yagi

JaeDuk Jo

A full body of a glass sheet (G) is cut by forming an initial crack () on a preset cutting line () of the glass sheet (G) that is supported by a support member (()) from a back surface side of the glass sheet (G), followed by propagating the initial crack () while passing through the glass sheet from a front surface to the back surface thereof due to a stress generated through localized heating along the preset cutting line () and cooling of a heated region that is formed through the localized heating, the glass sheet (G) being supported by the support member (()) from the back surface side through an intermediation of an elastic sheet (E) having low thermal conductivity.

Method for cutting plate-like glass, and cutting device therefor

Provided is a cleaving method for a glass film (G) including: cleaving, during conveyance of the glass film (G) in a predetermined direction, the glass film (G) continuously along a preset cleaving line () extending in a predetermined conveying direction (a) by a thermal stress generated through localized heating performed along the preset cleaving line () and through cooling of a locally heated region (H); dividing the glass film (G) in a width direction of the glass film (G); diverting, after the dividing, adjacent divided glass films (), which are obtained by the dividing, so that the adjacent divided glass films () are separated in a front and rear direction of the adjacent divided glass films; and forming a predetermined widthwise clearance between the adjacent divided glass films after the dividing of the glass film (G) and before the diverting of the adjacent divided glass films ().

Cleaving method for a glass film

Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line () of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line () of the glass sheet (G) under a state in which support members (()) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line () toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line ().

Disclosed is a method for fabricating a lightweight and thin liquid crystal display (LCD) device, using a supplementary substrate for processing of a thin glass substrate. Inactive gas is sprayed onto the surface of the substrate to thus remove OH groups from the surface, before the thin glass substrate and the supplementary substrate are attached to each other. Under such configuration, the supplementary substrate can be easily separated from a completed liquid crystal panel which is in an attached cell state, without any damages.

Method of fabricating lightweight and thin liquid crystal display device

A manufacturing method for a glass film includes a cleaving step of dividing a glass film having a band shape into a product glass portion and an unnecessary glass portion, and a collecting step of sequentially shattering the unnecessary glass portion, and collecting the shattered unnecessary glass portion. The cleaving step is followed by vibration regulating processing of regulating vibrations of the unnecessary glass portion in a thickness direction thereof, the vibration regulating processing being executed in at least one location in the longitudinal direction of the unnecessary glass portion, and the collecting step being executed on a downstream side of the at least one location of the vibration regulating processing.

Manufacturing method for a glass film

A glass film cleaving method includes cleaving a full-body of a glass film having a thickness of 200 &#x3bc;m or less by propagating an initial crack along a preset cleaving line through heating of the glass film with a laser beam followed by subsequent cooling of the glass film. The method also includes manufacturing a glass film laminate by setting a surface roughness Ra of a surface of the glass film to contact a support glass, which supports the glass film, and a surface of the support glass to contact the glass film to 2.0 nm or less, and by bringing the surfaces of the glass film and the support glass into surface contact with each other, followed by the cleaving.

Glass film cleaving method and glass film laminate

A method of cleaving and separating a glass sheet includes a cleaving step of cleaving a glass sheet along preset cleaving lines by a laser cleaving method, and a separation step of separating adjacent pieces of the cleaved glass sheet from each other. The cleaving step is performed under a state in which the glass sheet is placed on support members provided respectively in segment regions, which are segmented by the preset cleaving lines. The separation step is performed by separating the support members from each other in adjacent segment regions.

Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet

Provided is a method of cleaving and separating a glass sheet (G), the method comprising: a cleaving step of cleaving the glass sheet (G) along preset cleaving lines (X, Y) by a laser cleaving method; and a separation step of separating adjacent pieces of the cleaved glass sheet (G) from each other, wherein the cleaving step is performed under a state in which the glass sheet (G) is placed on a sheet (S) having stretchability, and the separation step is performed by stretching the sheet (S).

Method of cleaving and separating a glass sheet

In a cleaving apparatus for a glass film, an initial crack, which is formed at a leading end portion of a preset cleaving line of a glass film, is propagated along the preset cleaving line by a thermal stress generated in the glass film through localized heating performed along the preset cleaving line and cooling of a heated region resulting from the localized heating. At this time, a resin sheet having higher flexibility than the glass film is arranged in a cleaving region, and the resin sheet is floated by blowing a gas on a lower surface of the resin sheet by a floating unit. Then, a preset cleaving portion of the glass film including the preset cleaving line is lifted and supported while being covered with the floated resin sheet from below, and in this state, the glass film is cleaved.

The present invention provides a UWB communication device and a UWB communication method with which the communication speed can be improved, and with which accurate sending and receiving of data and a lower power consumption can be achieved. A communication device in accordance with the present invention employs a sending/receiving method of sending four bits of data within four cycles of a system clock, sending the four bits of data by correlating them in a 1-to-1 relationship with seven types of pulse waveforms with only one pulse during the first seven half-cycles and nine different types of pulse waveforms with two pulses during the first seven half-cycles of four cycles of the system clock, and at the receiving side demodulating the modulated input data by correlating the sixteen types of pulse waveforms that have been sent back to the four bits of data. Furthermore, when receiving, the width of the received pulses is set to a length of 1.5 cycles of the quadruple system clock, and phase shifts are detected and adjusted by sampling the received pulses with the rising edges of the quadruple system clock.

Growing community of inventors

Shiga, Japan

Yasuhiro Matsumoto