Canon Kabushiki Kaisha

Yasuhiro Matsuki

Koji Tsuduki

Shin Hasegawa

Takanori Suzuki

Tadashi Kosaka

Hisatane Komori

Akiya Nakayama

Fujio Ito

Yasushi Kurihara

Satoru Hamasaki

Kazuya Notsu

A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Electronic component and electronic apparatus

A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition &#x3b1;, &#x3b1;, &#x3b1;&#x3c;&#x3b1;is satisfied, where &#x3b1;is a thermal expansion coefficient of the lid body, &#x3b1;is a thermal expansion coefficient of the frame body, &#x3b1;is a thermal expansion coefficient of the base body, and &#x3b1;is a thermal expansion coefficient of the wiring member.

Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus

A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.

Electronic component, mounting member, electronic apparatus, and their manufacturing methods

An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Image pickup module with improved flatness of image sensor and via electrodes

A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting &#x3b1; rays, an amount of the &#x3b1; rays being smaller than or equal to 0.05 c/cm&#xb7;h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Method of manufacturing optical sensor, optical sensor, and camera including optical sensor

A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Method of manufacturing optical sensor

A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies Htan(&#x3b8;A&#x2212;2&#x3b8;C)&#x2266;LLat any point on the upright surface, and H tan(&#x3b8;A&#x2212;2&#x3b8;B)+(H)tan &#x3b8;B&#x2266;Land &#x3b8;B&#x3e;&#x3b8;C at any point on the non-vertical surface, where &#x3b8;A is the inclination of incident light, &#x3b8;B is the inclination at a point on the non-vertical surface, &#x3b8;C is the inclination at a point on the upright surface, His the height of the non-vertical surface, His the height of the upright surface, H is the height of the frame portion, Lis the distance from the edge of a pixel region to the upper edge of the upright surface, and Lis the distance from the upper edge to the lower edge of the upright surface in the planar direction.

Solid-state image pickup device

A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

Growing community of inventors

Atsugi, Japan

Yasuhiro Matsuki