Nec Corporation

Yasuhiro Kurokawa

Kazuaki Utsumi

Yuzo Shimada

Hideo Takamizawa

Masato Ujiie

A semiconductor device includes a semiconductor pellet (1), and a package having a pellet mount portion (21) on which a semiconductor pellet (1) is mounted. The semiconductor pellet (1) is mounted on the pellet mount portion (21) of the package through a joint material (6). The area of the surface of the pellet mount portion (21) on which the semiconductor pellet (1) is mounted is set to be smaller than the area of the surface of the semiconductor pellet (1) which is mounted on the pellet mount portion (21), thereby preventing the climb-up of the joint material (6) along the side surface of the semiconductor pellet (1).

Mount for semiconductor device

A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface which faces away from the package substrate, a thin pliable electrically insulating resin layer applied to the surface of each semiconductor element, a metal cap which cooperates with the package substrate to hermetically enclose the space containing one or more semiconductor elements, and a heat diffusing plate of high thermal conductivity provided between the electrically insulating resin layer of each semiconductor element and the metal cap. A part of heat generated in the active layer is conducted through the heat diffusing plate to the metal cap and is released there, thereby shortening the heat path and reducing the heat-releasing surface of the package substrate.

Package for semiconductor elements having thermal dissipation means

A packaged semiconductor device has a wiring substrate. A plurality of semiconductor device chips are connected to the wiring substrate by a use of bumps. A heat sink is bonded through a high heat conductive bonding layer to a surface of each of the semiconductor device chips. In addition, a package casing which accommodates the semiconductor device chips and the wiring substrate, has internal conductors which are positioned in the inside of the package casing. External connection pins extend outwardly from the package casing and are connected to corresponding internal conductors. The wiring substrate is connected to the internal conductors of the package casing via a flexible wiring circuit member. The flexibility of this wiring permits the thermal expansion and contraction to occur without breaking the connections to the bumps.

Package structure for semiconductor device having a flexible wiring

A multi-layer circuit board is disclosed which includes a plurality of AlN ceramic layers stocked and combined as an integrated form and wiring layers interposed at different levels between the AlN ceramic layers. The wiring layers are made of a mixture of tungsten and AlN ceramic particles, the content of the AlN ceramic particles being 0.5 to 2.0 wt. %. A plurality of through-holes are formed in the AlN ceramic layers to interconnect the wiring layers formed at different levels.

Multi-layer circuit board having a large heat dissipation

Aluminum nitride ceramics is prepared by mixing acetylide of calcium, strontium, barium or other material with raw aluminum nitride powder with a content between 0.02 and 10 wt %, forming the mixture into a predetermined shape and sintering the formed body in a non-oxidizing atmosphere such as nitrogen gas by pressureless and/or pressure sintering technique.

Growing community of inventors

Tokyo, Japan

Yasuhiro Kurokawa