Sanyo Electric Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Panasonic Intellectual Property Management Co., Ltd.

Yasuhiro Kohara

Ryosuke Usui

Masayuki Nagamatsu

Yasunori Inoue

Makoto Murai

Yusuke Igarashi

Mayumi Nakasato

Takeshi Nakamura

Hijiri Nakahara

Kiyoshi Shibata

Mitsunori Harada

Toshiya Shimizu

Hideki Mizuhara

Koichi Saito

Yasuyuki Yanase

Noriaki Kojima

Masaharu Akitomo

Morihide Ohsaki

Nobuhisa Takakusaki

Kenji Takii

Yasuhiro Asai

Masurao Yoshii

Takashi Seto

Ryosuke Usul

Kotaro Deguchi

Daiki Uchiyama

Koutaro Deguchi

Tohru Sakata

Kohji Wakashiro

Sadao Matsushita

Toru Shirai

An assembled battery comprises: multiple cellseach having external terminals including a negative electrode terminaland a positive electrode terminal; a bus barwhich connects the external terminal of one of two adjacent cellsand that of the other thereof; an electrically-conductive connecting memberwhich connects the external terminal and the bus barby welding to the external terminal and the bus bar; a welding portionwelded to the bus barand the connecting member; and a welding portionwelded to the external terminal and the connecting member. The connecting membercomprises an intervening portionconnected to the welding portion, and a main body portionextending from the intervening portionto the welding portion. The intervening portionhas a thickness that is smaller than that of the main body portion

Assembled battery and cell connection method

This semiconductor device (A) includes: a transparent conductive layer (); an insulating layer () which is formed to cover the transparent conductive layer () and which has a hole () that overlaps at least partially with the transparent conductive layer (); a metal layer () formed on the insulating layer () and inside the hole (); and a contact portion () connecting the transparent conductive layer () and the metal layer () together. In the contact portion (), a refractory metal nitride layer () is arranged between the transparent conductive layer () and a portion of the metal layer () which is located inside the hole (). The refractory metal nitride layer () is in contact with the upper surface of the transparent conductive layer ().

Semiconductor device and production method therefor

A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.

Device mounting board, semiconductor module, and method for fabricating the device mounting board

A liquid crystal display element disclosed includes: a first substrate; a second substrate; a liquid crystal layer sandwiched between the first substrate and the second substrate; a first transparent electrode provided at a display region of the first substrate; and a second transparent electrode provided at a display region of the second substrate, at least one of dand dbeing not larger than 60 nm, where drepresents a thickness of the first transparent electrode and drepresents a thickness of the second transparent electrode.

Liquid crystal display element and liquid crystal module

Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.

Element mounting board and semiconductor module

Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

Element mounting substrate and semiconductor module

The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200&#xb0; C. to 300&#xb0; C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

Metal bonding method and metal bonded structure

A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.

Method of fabricating a circuit apparatus

The present invention provides a production method of a color filter substrate that can efficiently produce a color filter substrate including a multi-layer spacer. The production method of the color filter of the present invention is a production method of a color filter substrate including a colored layer, an electrode, a light-shielding layer, and a multi-layer spacer on a substrate,

Production method of color filter substrate, production method of liquid crystal display device, color filter substrate, and liquid crystal display device

Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Circuit board and circuit device

A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.

Packaging board, semiconductor module, and portable apparatus

A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.

Circuit device with circuit board and semiconductor chip mounted thereon

A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.

Circuit board and method of manufacturing circuit board

A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

Circuit device

A method for inspecting a color filter includes a first step of disposing the color filter so that the color filter is opposed to a light source, a second step of outputting, from the light source, monochromatic light of a color corresponding to one of the colors of color layers of the color filter and entering the light into the plurality of color layers, and a third step of inspecting for display unevenness in each of the color layers with light transmitted through the color layers.

Growing community of inventors

Gifu, Japan

Yasuhiro Kohara