Mitsubishi Chemical Industries Limited

Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Chemical Corporation

Mitsubishi Kasei Corporation

Samsung Electronics Co., Ltd.

Techno Semichem Co., Ltd.

Yasuhiro Kameyama

Tameichi Ochiai

Konoe Miura

Tomoharu Mametani

Takashi Okabe

Tooru Koyama

Hoon Jong Kang

Noriaki Takahashi

Hi-Kuk Lee

Yang-Ho Jung

Jae-Sung Kim

Shuichi Maeda

Takashi Miyazawa

Jong-cheol Kim

Ryuichiro Takasaki

Se-Jin Choi

Shichiro Takahashi

Yuuji Mizuho

A negative photoresist composition and a method of manufacturing an array substrate. The negative photoresist composition includes a photocurable composition including an ethylene unsaturated compound containing an ethylene unsaturated bond and a photopolymerization initiator, a thermosetting composition including an alkali-soluble resin crosslinked by heat and an organic solvent. The negative photoresist composition improves stability, photosensitivity, detachability after performing a developing operation and reduces residue to improve the reliability of an organic insulation layer. Furthermore, the negative photoresist composition improves the transmittance of an organic insulation layer and reduces the variation of color coordinates to improve the display quality of a display apparatus.

Negative photoresist composition and method of manufacturing array substrate using the same

An optical recording medium comprising a substrate and a recording layer on which recording and readout of information can be carried out by laser.

Compound, optical recording medium and optical recording method

Disclosed are a negative photosensitive composition comprising an alkali-soluble resin, a photo acid generating system, and a crosslinking agent for the alkali-soluble resin which acts on the resin under acidic conditions, in which the crosslinking agent is a highly-alkylated alkoxymethylmelamine resin having a monomer content of from 5 to 40% by weight, and a method for forming a negative photo-resist pattern using the composition. The resist composition is stable during storage and gives good pattern profiles having high aspect ratios even though the resist film is made thick.

Negative photosensitive composition and method for forming patterns

A negative photosensitive composition comprising (a-1) a compound having at least two organic groups of the following formula (I):

Negative photosensitive composition and method for forming a resist

Disclosed herein is an antistatic photo-resist containing an antistatic agent. Since antistatic photo-resist according to the present invention is hardly charged, it can be suitably used as a mask in implanting ions into semiconductor substrate.

Positive type o-quinone diazide photo-resist containing antistatic agent

Positive quinone diazide photo-resist composition with antistatic agent

Disclosed herein is a positive photoresist composition containing (a) a photosensitizer of 1,2-napthtoquinone diazides photosensitive-material comprising an ester of 2,3,4,4'-tetrahydroxybenzophenone in which on the average, not less than two hydroxyl groups of 2,3,4,4'-tetrahydroxybenzophenone have been esterified by 1,2-naphthoquinonediazide-5-sulfonic acid and (b) a novolak resin obtained by condensing a mixture of m-cresol, p-cresol and 2,5-xylenol with formaldehyde.

Positive photoresist composition

Disclosed herein is a positive photoresist composition containing (a) a photosensitizer of 1,2-naphthoquinone diazides photosensitive-material comprising an ester of 2,3,4,4'-tetrahydroxybenzophenone in which on the average, not less than two hydroxy groups of 2,3,4,4'-tetrahydroxybenzophenone have been esterified by 1,2-naphthoquinonediazide-5-sulfonic acid and (b) a novolak resin obtained by condensing a mixture of m-cresol, p-cresol and 2,5-xylenol with formaldehyde.

Positive photoresist composition with 1,2 naphthoquinone diazide and

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Machida, Japan

Yasuhiro Kameyama