Kabushiki Kaisha Toshiba

Hitachi, Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Nissan Motor Company Limited

Yasuhiro Iwata

Shinichi Kazui

Kaoru Katayama

Hiroshi Fukuda

Toshihiko Ohta

Mitsunori Tamura

Mitsugu Shirai

Mitugu Shirai

Hideaki Sasaki

Tsutomu Shibuya

Hidehiro Nishizawa

Osamu Yamada

Toshiyuki Watanabe

Ryohei Satoh

Tetsuya Hayashida

Kunihiro Shibuya

Masahito Ijuin

Kohachi Uchida

Toru Nishikawa

Shuzo Tsubo

Masao Saitou

Seiichi Kobayashi

Toshio Takano

Yuzi Uchigasaki

Keiichi Shindo

Atsushi Fujimoto

Masamitsu Higuchi

Koji Kubo

Masahide Hara

Hiroko Takehara

There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Surface reformation method of high polymer material

The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Process for manufacturing electronic circuits

A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Laser assisted surface reformation method of high polymer material

A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

Method of fabricating an electronic circuit device

Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.

Process for making electronic device

In an image forming apparatus, the setting of documents on a document table, and designation of a numeric value more than '1' as the number of copies are detected. A message for inquiring whether to set a sort/stack mode is displayed and an operation is started in accordance with a mode designated by a user in response to this display.

Image forming apparatus having sort/stack mode inquiring and selecting

An image forming apparatus is disclosed. In this apparatus, setting of documents on a document table, and designation of a numeric value more than '1' as the number of copies are detected. In accordance with this detection, a message for inquiring whether to set a sort/stack mode is displayed. An operation is started in accordance with a mode designated by a user in response to this display.

Image forming apparatus having sorting function

A device for stapling sheets at a stapling zone includes a conveyor for conveying the sheets to be collated to the stapling zone, a detector for detecting the overall thickness of sheets conveyed by the conveyor to the stapling zone, a first stapler for stapling the sheets collated at the stapling zone, and a second stapler for stapling the sheets collated at the stapling zone. In the device, one of the first and second staplers is selected to be actuated in accordance with the overall thickness of the stack of sheets detected by the detector.

Stapling device and image forming apparatus having a stapling device

When an original is carried onto a support by a carrier in accordance with a depression of a copy key a density of an image formed on a transferred medium is decreased. Formation of an unwanted image caused by an opening portion of a covering can be prevented, and a good image can be formed.

Image forming apparatus eliminating image of document cover

The image forming apparatus according to this invention is adapted to erase unnecessary black images otherwise appearing on the peripheral portion of a copy sheet so that output images of a high quality are obtained. Further, erasable peripheral areas of the copy sheet on which unnecessary black images are otherwise formed are freely selected.

Image forming apparatus having erasing means for erasing an electrical

Growing community of inventors

Yokohama, Japan

Yasuhiro Iwata