Fujitsu Corporation

Fujistu Limited

Yasuhiro Ichihara

Hiroshi Iimura

Yasushi Kobayashi

Yasuhiro Teshima

Yutaka Higashiguchi

Toshio Kumai

Mamoru Niishiro

Seiji Kogure

Shuzo Igarashi

Fumio Arase

Yukio Sekiya

Toshiya Kishida

Mitsuo Inagaki

Takashi Shiotani

Yasuhide Kuroda

Shozo Suzuki

Shoichi Hayashi

Ryoichi Ochiai

Hideaki Tamura

Seishi Chiba

A circuit board storage bag and a storage rack are disclosed. A plurality of printed circuit board storage bags for accommodating a circuit board comprise a front surface portion and a rear surface portion opposed to the obverse and reverse surfaces, respectively, of the circuit board accommodated in the circuit board storage bag and connecting portions for connecting the front surface portion and the rear surface portion. The front surface portion and the rear surface portion bend at the connecting portions to open and close the circuit board storage bag for use in transporting the circuit board. The circuit boards are stored in a storage rack having an inclined mounting surface for mounting the storage bags and a bag stopper at the lower end of the mounting surface. The bags are stored in vertical position on one side at the lower end of the mounting surface.

Circuit board storage bag and storage rack

A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.

Receptacle type optical transmitter and/or receiver module

A laser diode module including a laser diode assembly having a laser diode and a holder, a lens-fiber assembly having a lens and an optical fiber fixed in a given positional relationship, and a sleeve. The lens-fiber assembly includes a casing having a first hole and a second hole offset from the first hole. The lens is inserted and fixed in the first hole, and a ferrule in which the optical fiber is embedded is press-fitted with the second hole. The ferrule has a slant polished first end and a second end projecting from an end surface of the casing by a given distance. The lens and the ferrule are fixed in the casing so that a given distance is defined between the lens and the first end of the ferrule.

Laser diode module and assembling method therefor

A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Electronic component package, printed circuit board, and method of inspecting the printed circuit board

A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Electronic component package, printing circuit board, and method of inspecting the printed circuit board

A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Semiconductor device having a bump which is inspected from outside and a

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

Growing community of inventors

Kawasaki, Japan

Yasuhiro Ichihara