Sharp Kabushiki Kaisha Corporation

Yasuhiro Hida

Gen Nagaoka

Hiroki Miyazaki

Motoji Shiota

Yukio Shimizu

Ichiro Umekawa

Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel () and an FPC () are electrically connected, an alignment mark in the FPC () is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark () in the touch panel () is also formed by an opaque metal film, the visibility of the alignment mark () also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel () and the FPC () can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.

Circuit board, substrate module, and display device

Affixed to a projection () of a glass substrate () included in a liquid crystal module () are a first ACF (), which has low surface tack strength but high connection reliability, and a second ACF (), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (), electronic components (), etc., are mounted on the glass substrate (), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

Board module and fabrication method thereof

The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate. The opposed substrate has a second routing wiring, and a second terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the second routing wiring, at an end portion of the substrate. The first routing wiring and the second routing wiring conduct with each other via the common transfer section.

Display panel, display device, and method manufacturing same

A liquid crystal display device () includes a glass substrate () having an LSI chip () and an FPC board () mounted thereon. A component ACF () made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors () on the glass substrate (). The component ACF () has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip () and the FPC board () which are mounted first. By thus using the large component ACF (), a positional constraint upon adhering the component ACF () to the glass substrate () is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

Growing community of inventors

Osaka, Japan

Yasuhiro Hida