Tdk Corporation

Yasuhiro Hara

Wataru Nakahori

Haruhiko Sanae

Masaki Sato

Hiroshi Miyazaki

Torao Misono

In a power supply device, a first space Rand a second space Rare delimited, a coil componentis arranged in the first space R, and heat-generating components and components having weak resistance to heat are arranged in the second space R. The power supply deviceis configured to contain the coil componentin the first space Rso that ambient air of the coil componentcan contact a first side wall, which constitutes the first space R, making it possible to expect discharge of heat to coolant in a coolant channel W via the first side wall. Therefore, heat can be discharged from the ambient air of the coil component, the temperature of which has been raised by heat generation, towards the coolant efficiently.

Power supply device

In the coil unitA of the power supply device, the U-shaped plateC constituting the U-shaped terminalis used to electrically connect the print-coil substrates. Further, the print-coil substratesconstituting the coil unitA can be connected to the main circuit substratealso by using the U-shaped terminal. Here, the print-coil substrateis connected to the print-coil substrateby using the U-shaped terminal, by which soldering for fixing the U-shaped terminalis performed from the lower face side of the print-coil substrate. Therefore, as compared with a conventional constitution where soldering is performed from both sides of the stacked print-coil substrates, the print coils can be connected by soldering only from one side face, thus making it possible to reduce the amount of work necessary for connecting the print coils.

Growing community of inventors

Tokyo, Japan

Yasuhiro Hara