Nippon Denkai, Ltd.

Yasuhiro Endo

Toshio Kawasaki

Hitoshi Yokono

Masahiro Mikamo

Tsuyoshi Onuma

Ryouichi Narushima

Sayaka Kinoshita

Haruki Yokono

Shota Moroe

Hiroki Hara

Nobuchika Yagihashi

Takuya Iida

A surface-treated copper foil which maintains peel strength against the resin substrate of the surface-treated copper foil and achieves desired low transmission loss even at high frequencies includes an electrolytic copper foil, at least one roughened layer that covers one surface of the electrolytic copper foil, an anti-rust layer that covers the at least one roughened layer, and a silane coupling agent-treated layer that covers the anti-rust layer, in which a surface of the surface-treated copper foil on a side of the layers has a developed interfacial area ratio Sdr of 40% or less, an arithmetic mean peak curvature Spc of 200 mm-1 or less and a root mean square gradient Sdq of 0.30 to 0.90, or particles on the surface to be bonded of the surface-treated copper foil have an average particle size of 0.50 μm or less and an average particle length of 0.40 to 0.70 μm.

Surface-treated copper foil

An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm, the number of grains changing to 0.6 to 1.0/μmby heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.

Electrolytic copper foil and method for producing same

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/min terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μmand the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

Surface-treated copper foil and method for manufacturing same

A method of producing a roughening-treated copper foil, comprising (A) a copper foil, (B) a composite metal layer, which is formed on a bonding surface of the copper foil and comprises (I) copper, (II) at least one metal selected from the group consisting of tungsten and molybdenum and (III) at least one metal selected from the group consisting of nickel, cobalt, iron and zinc, and (C) a roughened layer comprising copper, which is formed on the composite metal layer.

Method of producing a roughening-treated copper foil

A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.

Method of producing copper foil for fine wiring

A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.

Growing community of inventors

Shimodate, Japan

Yasuhiro Endo