Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Yasuhiro Chouno

Norihiro Ito

Masahiro Yoshida

Hiroshi Tanaka

Issei Ueda

Osamu Kuroda

Satoshi Morita

Tadashi Iino

Junya Minamida

Takashi Terada

Satoshi Nakashima

Keigo Satake

Kazuyoshi Eshima

Yoshiyuki Honda

Shinya Murakami

Eiichi Mukai

Kenji Yokomizo

Chihaya Tashima

Naohiko Hamamura

Hiroaki Kawaguchi

Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Substrate processing apparatus

The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N&#x2212;n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N&#x2212;n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N&#x2212;n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N&#x2212;n is not less than 2.

Substrate processing method and substrate processing system

A steam generator' provided in a substrate processing apparatus includes a tankhaving a hollow cylindrical memberformed of a composite of PTFE and PFA and a pair of side wall platesconnected to the opposite ends of the cylindrical memberThe tankis surrounded by a shellof an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heateris attached to the outer surfaces of the plate membersof the shellThe shellrestrains the tankand compresses elastic sealing membersto sealingly engage the cylindrical memberand the side wall platewith each other.

Substrate processing device

A common solvent vapor supply sourceand a common processing gas supply sourcesupply ozone gas and steam to a plurality of processing vesselsA,B. Pressures in the processing vessels are regulated by adjusting the openings of the valuable throttle valvesA,B, which are placed in exhaust linesA,B, respectively.

Substrate processing apparatus and substrate processing method

In a pneumatically driven liquid supply apparatus comprising a circulation pump,or constant-volume pump,for supplying a washing liquid or chemical to a washing tank,for semiconductor wafers used during the fabrication of semiconductor devices; an electromagnetic switching valve,and a pressure regulator,that configure an air-pressure adjustment means,are connected to an air source,; and air supply pipelines,, and,are each connected to the air-pressure adjustment means,, the circulation pump,and the constant-volume pump,. A leakage sensor,is interposed within each of the air supply pipelines,, and,between the air-pressure adjustment means,and the circulation pump,or constant-volume pump,, so that any liquid that flows backward through the circulation pump,or the constant-volume pump,and into the air supply pipeline,, or,is detected by the leakage sensor,. This makes it possible to prevent damage or halting of the functions of the air-pressure adjustment means due to liquid flowing into the air supply pipelines via one of the pumps.

Pneumatically driven liquid supply apparatus

A substrates-washing apparatus includes a process vessel in which washing solution is stored to wash a plurality of substrates, a boat for holding the substrates parallel to one another in the process vessel, solution supply openings formed in the bottom of the process vessel, a solution supply system communicated with the solution supply openings to supply washing solution into the process vessel through the solution supply openings, and a straightening plate arranged between the substrates held on the boat and the solution supply openings in the bottom of the process vessel and provided with a plurality of apertures through which washing solution passes. The apertures form plural lines in the longitudinal direction of the straightening plate, the apertures in each line are arranged to correspond to the substrates alternately, and the apertures in one line are shifted from those in the other adjacent line.

Substrates-washing apparatus

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Tosu, Japan

Yasuhiro Chouno