Kobe Steel, Ltd.

Kabushiki Kaisha Kobe Seiko Sho (kobe Steel, Ltd.)

Kobelco & Materials Copper Tube, Ltd.

Kabushiki Kaisha Kobe Seiko Sho

Yasuhiro Aruga

Katsushi Matsumoto

Katsura Kajihara

Hisao Shishido

Takeshi Kudo

Ryoichi Ozaki

Yosuke Miwa

Akira Fugono

Shinya Katsura

Kazuharu Masada

Yuji Inoue

Kiyohito Tsuruda

Masato Watanabe

Mamoru Nagao

Takashi Shirai

Yasuaki Sugizaki

Toshiaki Takagi

Koya Nomura

Hidemasa Tsuneishi

Akihiko Ishibashi

Daisuke Hashimoto

Katsura Kajhara

Hiroshi Sakamoto

Yukio Sugishita

The aluminum alloy sheet of the present invention is a specific 6000-series aluminum alloy sheet in which the total sum (total amount) of Mg and Si existing in specific aggregates of atoms (clusters) is regulated and the total sum of Mg and Si existing in the aggregates of atoms is ensured so as to be balanced with the total amount of Mg and Si solid-solutionized in the matrix, and thus BH response (bake hardenability) after natural aging at room temperature and proof strength after BH treatment (bake hardening treatment) are further improved.

Aluminum alloy sheet with excellent baking paint hardenability

Provided is an Al&#x2014;Mg alloy plate for molding, having excellent press formability, little stretcher strain (SS) mark generation, and not generating any new issues such as reduced bending properties as a result of age-hardening at room temperature, while using more accurate and simple structural indicators. As a result, the Al&#x2014;Mg aluminum alloy plate comprising a specific composition including Cu has a plate structure having an average particle diameter of 0.5-6.0 nm in a minute particle (cluster) particle distribution measured using an X-ray scattering method, controls the volume fraction to at least 0.03%, is unlikely to have serration, and suppresses SS mark generation during press forming.

Aluminum alloy plate for forming

The invention provides a Cu&#x2014;Ni&#x2014;Sn&#x2014;P alloy sheet satisfying the resistance property of stress relaxation in the direction perpendicular to the rolling direction and excellent in the other necessary properties as terminals and connectors. The invention relates to a Cu&#x2014;Ni&#x2014;Sn&#x2014;P alloy sheet having a specific composition, which is made to contain specific atomic clusters containing at least any of an Ni atom or a P atom, as detected with a three-dimensional atom probe field ion microscope, in a specific density, by increasing the reduction ratio in the final cold rolling and by intentionally shortening the time for the rolling and the time to be taken before the final annealing at low temperature, and of which the necessary properties as a terminal or connectorare improved in that the resistance property of stress relaxation thereof in the direction perpendicular to the rolling direction is enhanced and the difference (anisotropy) in the resistance property of stress relaxation thereof between the parallel direction and the perpendicular direction to the rolling direction is reduced.

Copper alloy sheet excellent in resistance property of stress relaxation

The present invention provides a Cu&#x2014;Fe&#x2014;P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet

A 6000-series aluminum alloy plate, which is obtained by introducing a minor amount of Sn into a 6000-series aluminum alloy plate that has a specific Mg and Si composition, and controlling the tissue of the plate on the basis of the tissue thereof under a specific heat treatment, shows an improved hem bendability even after aging for a long period of time at room temperature, as a characteristic after the natural aging, and increases the bake hardenability (BH response) in baking finishing a molded automobile panel.

Aluminum alloy having excellent characteristic after natural aging at room temperature

A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 &#x3bc;m; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

Copper alloy

The present invention provides a copper alloy tube for heat exchangers which is tolerable to a high operating pressure of new cooling media such as carbon dioxide and HFC-based fluorocarbons, and is excellent in fracture strength, even if the tube is thinned, and a copper alloy tube for a heat exchanger which has a composition having specified amounts of Sn and P, has an average crystal grain size of 30 &#x3bc;m or less and has a high strength of 250 MPa or more of a tensile strength in the longitudinal direction of the tube improves the fracture strength as a texture in which the orientation distribution density in the Goss orientation is 4% or less.

Copper alloy tube for heat exchanger excellent in fracture strength

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width &#x3b2; of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheet for electric and electronic part

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width p of the intensity of diffraction of {311} plane in the surface of a Cu&#x2014;Fe&#x2014;P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200) /I (220)) of intensity of diffraction of (1 (200)) from the (200) plane in the sheet surface to intensity of diffraction of (I (220)) from the (220) plane, is 0.3 or less. In addition, a Cu&#x2014;Fe&#x2014;P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 &#x3bc;m or less.

Copper alloy sheets for electrical/electronic part

An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the area fraction of MgSi intermetallic compound grains having a maximum length of 1 &#x3bc;m or more is 0.10% or more in a region of a section of the aluminum-alloy sheet, the region being a central region in the thickness direction of the aluminum-alloy sheet, and the aluminum-alloy sheet has a proof stress of 225 to 270 N/mmafter having been baked at 270&#xb0; C. for 20 seconds.

Aluminum-alloy sheet and method for producing the same

An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the solute Mn content is 0.12 to 0.20 mass %, and the aluminum-alloy sheet has a proof stress of 225 N/mmor more after having been baked at 270&#xb0; C. for 20 seconds.

Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 &#x3bc;m or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.

This aluminum alloy sheet is a 6000-series aluminum alloy sheet of a specific composition which, after rolling, has undergone solution hardening and reheating as tempering treatments. The aluminum alloy sheet in differential scanning calorimetry gives a curve in which the exothermic-peak heights A, B, and C in respective specific temperature ranges have relationships within specific given ranges to thereby raise the increase in 0.2% proof stress through low-temperature short-time artificial age-hardening to 100 MPa or more.

Aluminum alloy sheet with excellent paint-bake hardenability

This aluminum alloy sheet has increased BH properties under low-temperature short-time-period conditions after long-term room-temperature aging by means of causing aggregates of specific atoms to be contained having a large effect in BH properties, the distance between atoms being no greater than a set distance, and containing either Mg atoms or Si atoms measured by 3D atom probe field ion microscopy in a 6000 aluminum alloy sheet containing a specific amount of Mg and Si.

Aluminum alloy sheet excellent in baking finish hardenability

The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

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Kobe, Japan

Yasuhiro Aruga