Kyocera Corporation

Yasuhiko Yoshihara

Masamitsu Onitani

Shigeki Yamada

Yuji Tanaka

Masanobu Ishida

Shinichi Suzuki

Koichi Nagata

Yasuhiro Sasaki

Takayuki Ikeuchi

A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same thickness as the first ceramic sheet, such as a resin sheet a metal sheet or a ceramic sheet of a material different from that of the first ceramic sheet. A first method comprises a step of preparing a first ceramic sheet from a ceramic powder, and a different kind of sheet; a step of forming a through hole in a predetermined portion of the first ceramic sheet; a step of laminating the different kind of sheet on the ceramic sheet in which the through hole is formed; and a step of preparing a composite sheet by pressing the portion of the first ceramic sheet where the through hole is formed from the side of the different kind of sheet, such that the first ceramic sheet and the different kind of sheet are integrated together. A second method comprises a step of preparing a first ceramic sheet and a different kind of sheet, and laminating the first ceramic sheet and the different kind of sheet one upon the other; and a step of preparing a composite sheet by pressing a predetermined portion of the laminate from the side of the different kind of sheet, such that the pressed portion of the different kind of sheet is transferred onto the side of the first ceramic sheet to integrate the first ceramic sheet and the different kind of sheet together. A further method is for producing a laminate by laminating the obtained composite sheet on other first ceramic sheet or on other composite sheet.

Method of producing a composite sheet and method of producing a laminate by using the composite sheet

A wiring board having an insulating substrate of aluminum oxide ceramics and a surface wiring layer formed on the surface of said insulating substrate, wherein the aluminum oxide ceramics constituting said insulating substrate contains a manganese compound in an amount of from 2.0 to 10.0% by weight in terms of MnO,, and has a relative density of not smaller than 95%, and said surface wiring layer contains copper in an amount of from 10 to 70% by volume and at least one high-melting metal selected from the group consisting of tungsten and molybdenum in an amount of from 30 to 90% by volume, and further contains copper as a matrix, said copper matrix having a diffusion structure in which are diffused the particles of said high-melting metal having an average particle diameter of from 1 to 10 &mgr;m. The wiring board is prepared by co-firing the conducting paste for forming the surface wiring layer and the green sheet for forming the insulating substrate, and exhibits excellent heat conductivity and electric properties, and is particularly effectively used for the semiconductor devices that execute arithmetic operations at high speeds.

Wire board and method of producing the same

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Kokubu, Japan

Yasuhiko Yoshihara