Matsushita Electric Industrial Co., Ltd.

Yasuhiko Yokota

Ryoichi Takayama

Hidekazu Nakanishi

Koji Nomura

Takeo Yasuho

Takeshi Masutani

Toru Sakuragawa

Kazuhiko Fujikawa

Hayami Matsunaga

Tetsuo Kawasaki

Masao Iwata

Yoshikazu Suehiro

Junji Kajiwara

Ryoichi Katsuragawa

In a surface acoustic wave (SAW) filter including a substrate and an electrode formed on the substrate, the electrode includes a base layer, a first metal layer made of a metal consisting of Al or consisting mainly of Al, and having a given orientation relative to the substrate, a second layer for preventing the first metal layer from migration of Al atoms occurring in vertical to the substrate, and a third layer for adjusting a thickness of the layer. In this SAW filter having an arbitrary layer thickness, the layer hardly causes grain boundary diffusion, and grains of the layer can be made fine for effective resistance to stress. Thus, in this SAW filter, the migration of the Al atoms of the electrode that is associated with the SAW propagation-induced stress imposed on the electrode is inhibited. Accordingly, the filter exhibits excellent resistance against electric power.

Surface acoustic wave filter utilizing a layer for preventing grain boundary diffusion

The present invention relates to an apparatus for detecting an object-to-be-printed and aims at providing an apparatus for detecting an object-to-be-printed which is capable of discriminating whether the object-to-be-printed is plain paper or special paper. The apparatus includes an infrared sensor for detecting infrared rays radiated by heating the object-to-be-printed with heating means and is capable of discriminating whether the object-to-be-printed is plain paper or special paper.

Object-to-be-printed detector and print detecting method

The present invention relates to integrated circuit devices for use in such civilian equipments as an electronic equipment, electrical equipment, communication equipment and measuring and controlling equipment, and its object is to provide an integrated circuit device which has an excellent heat radiating characteristic. Then, in order to achieve this object, it includes, on a metal board,, a power supply,and a plurality of pin terminals,and includes, on a multi-layer circuit wiring board,, mounted component parts comprising a cache controller,, a cache memory section,, a data buffer LSI section,, a CPU chip,and a connector,; and, by mounting a reverse surface of the multi-layer circuit wiring board,having the mounted component parts provided thereon on the metal board,having the power supply,provided thereon through the pin terminal group,, it is possible to provide an integrated circuit device in which the degree of integration is enhanced and the heat radiating characteristic of heat generating component parts is excellent.

Integrated circuit device on metal board with CPU power converter

Growing community of inventors

Osaka, Japan

Yasuhiko Yokota