Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Danippon Screen Manufacturing Co., Ltd.

Yasuhiko Ohashi

Hitoshi Nakai

Shunsaku Kodama

Yasumasa Shima

Shigeru Kohara

In a substrate processing apparatus (), an enlarged sealed space () is formed by bringing a cup part () that forms a lateral space () around the outer periphery of a chamber () into contact with a chamber lid part () separated from a chamber body (). A scan nozzle () is attached to the cup part () in the lateral space () and supplies a chemical solution onto a substrate after moving to above the substrate through an annular opening (). During processing for cleaning the substrate and processing for drying the substrate, the scan nozzle () is housed in the lateral space () and an upper opening of the chamber body () is closed by the chamber lid part () to isolate the chamber space () from the lateral space () and seal the chamber space (). Thus, the chamber space () can be isolated from the scan nozzle (). This consequently prevents a mist or the like of the chemical solution supplied from the scan nozzle () from adhering to the substrate.

Substrate processing apparatus

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, a liquid receiving part, and an upper nozzle. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down. While the chamber cover is in contact with the chamber body, a small sealed space is formed and some processings involving pressure reduction or pressurization are performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. On an outer side relative to the annular opening, positioned are a first cup part and a second cup part. A processing liquid spattering from a substrate is received by the first cup part or the second cup part. In the substrate processing apparatus, it is possible to perform various processings in the small chamber.

A substrate treatment apparatus includes: a treatment chamber provided therein with a chemical solution treatment area for treating a substrate with a chemical solution and a drying treatment area provided above the chemical solution treatment area for drying the substrate; a substrate holding member vertically movably provided in the treatment chamber for holding the substrate; and a lifting mechanism vertically moving the substrate in the range between the chemical solution treatment area and the drying treatment area.

Substrate treatment apparatus

A loader station of substrate treating apparatus receives a transport cassette from a preceding stage. This transport cassette stores a plurality of substrates to be treated, arranged with a predetermined spacing therein. An empty processing cassette stands by at the loader station when the transport cassette arrives. The processing cassette is constructed to store the plurality of substrates arranged with a storage spacing that is independent of the storage spacing in the transport cassette but is optimal for surface treatment in the apparatus. In the loader station, a loader substrate transport robot transfers the substrates to be treated from the transport cassette to the empty processing cassette while absorbing any difference that may exist between the storage spacings of the respective cassettes. After being emptied, the transport cassette is transported through a transport cassette buffer to an unloader station, the now loaded processing cassette is transported to the unloader station by way of a predetermined transport path having treating baths therealong for cleaning and drying the substrates in the processing cassette. In the unloader station, an unloader substrate transfer robot transfers the treated substrates from the processing cassette to an empty transport cassette while absorbing any difference there may be between the storage spacings of the respective transport and processing cassettes. After unloading of the treated substrates, the empty processing cassette is transported through a processing cassette buffer to the loading station for standby, and the transport cassette storing the treated substrates is transported from the apparatus to a next stage.

Substrate surface treating apparatus and substrate surface treating

A method of taking out and transferring a plurality of wafers from each of a plurality of wafer carriers to a wafer conveyor robot includes the steps of taking out wafer groups inside the wafer carriers from respective wafer carriers and aligning the same on a straight line with respective wafer groups being spaced apart, shifting at least one of the wafer groups so that an interval between the spaced wafer groups becomes equal to intervals among the wafers in each of wafer groups, and holding the shifted wafer groups with the wafer conveyor robot. An apparatus for practicing this method is also disclosed.

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Kyoto, Japan

Yasuhiko Ohashi