Kabushiki Kaisha Yaskawa Denki

Yasuhiko Kawanami

Masato Higuchi

Tasuku Isobe

Akira Sasaki

Tetsuya Ito

Hidenori Hara

Takayuki Morihara

Koji Higashikawa

Akira Soma

Katsushi Terazono

Tetsumi Narita

Takashi Aoki

Kiyonori Koguma

Takamitsu Katsuki

Yukihisa Nakabayashi

A controller of a power conversion apparatus according to an embodiment causes a chopper and an inverter to generate an alternating-current (AC) voltage including first and second parts of an AC voltage waveform and causes the inverter to output the AC voltage. The chopper generates the first part having an absolute value higher than a voltage of a DC power supply, and the inverter generates the second part having an absolute value lower than the voltage of the DC power supply. The controller is configured to alternately turn on the first and second switching elements in a period during which the controller controls the chopper to generate the first part of the AC voltage waveform.

Power conversion apparatus and power conversion method

A power module includes a power module body portion and a wiring board. The power module body portion includes P-side semiconductor elements and N-side semiconductor elements, and a P-side terminal connection portion, a U-phase terminal connection portion, and an N-side terminal connection portion which establish electrical connection with the wiring board on an upper surface of the power module body portion and into which a current flows from the wiring board and from which a current flows to the wiring board.

Power converter

The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Wiring board and power conversion device

The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Power semiconductor module

Growing community of inventors

Fukuoka, Japan

Yasuhiko Kawanami