Hitachi Seiko, Ltd.

Hitachi Via Mechanics Ltd.

Hitachi Seiko Co., Ltd.

Yasuhiko Kanaya

Kunio Arai

Tamio Otani

Tamio Ohtani

Hiroshi Aoyama

Akira Irie

Masao Nishigai

Hiromi Nishiyama

Tetsuo Murakami

Kazunori Hamada

Katsuhiro Nagasawa

Toru Yuki

Norio Michigami

Tuyoshi Yamaguchi

Kunio Saitoh

Nobuyasu Nonaka

Kunio Saitou

Kazuhiro Kogure

A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

Fabrication method of printed circuit board and printed circuit board machining apparatus

A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

Manufacturing method of a multi-layered circuit board

An improved drill bit for high speed, small diameter drilling of printed circuit boards uses flute/land ratio tapering in combination with the appropriate web thickness and point, cutting or flute angles to obtain high quality, accurately positioned holes. In one embodiment, the web thickness at the tip is 15% of the drill diameter, the flute/land ratio is 2.0, the tip angle is 130.degree., the second cutting angle is 20.degree., the third cutting angle is 30.degree., the flute angle is 32.degree., the relief groove depth is 0.001', body length is 0.256' and the distance between the body end and the flute end is 0.01'. Such a bit is used in connection with an air jet cooling/cleaning system and a step feed drilling method wherein the first step is between four-six times drill diameter, the second step is between two-three times the drill diameter, and the third step and subsequent steps are between 1.5-2.5 times the drill diameter.

Drill bit and step feeding method

Pressure foot of printed circuit board drilling apparatus

The present invention relates to a printed wiring board and a method of manufacturing a printed wiring board. A first printed wiring board and a second printed wiring board, each including an insulating layer and a copper foil layer, are superposed on one another with a middle insulating layer therebetween with blind holes formed in the insulating layers of the boards to oppose one another, through-holes are formed and provided with conductive plating to electrically connect the copper foil layers with each other, and reflow pads are formed by etching in the copper foil layers to seal the blind holes. The blind holes are formed through the insulating layers and reach the copper foil layers. Plated layers are plated on the surfaces of the printed wiring boards on the sides thereof where the blind holes are formed to electrically connect the blind holes and the copper foil layers, respectively.

Printed wiring board having blind holes

Printed circuit board processing apparatus

A tool holding device for use in a printed circuit board processing machine is provided with a record which is capable of storing data concerning the states of tools held on the tool holding device and data concerning processing conditions and which enables reading and updating of the recorded content through a communication with an external control device. Necessity for renewal of data registered in the NC device, which has to be executed in the known apparatus each time the tool holding device is exchanged, is eliminated thereby improving the rate of operation of the printed circuit board processing machine. In addition, the present invention enables an easy automatic replacement of tools when the lives of the tools are expired.

Printed circuit board processing machine incorporating tool holding

Printed circuit board presser device in drilling machine

A method of and apparatus for effecting a machining operation, e.g. drilling, on a multi-layered printed circuit board utilizing a machining apparatus having a spindle for driving a tool. The spindle is movable in the axial direction of the tool and a pressure foot for pressing the printed circuit board during the machining is mounted on the spindle for relative movement with respect thereto. The method includes the steps of determining the position of the end of a tool with respect to the end of a pressure foot in the state before the pressure foot contacts the printed circuit board, setting the amount of relative movement between the pressure foot and the tool necessary for effecting the desired machining, on the basis of the position of the end of the tool and a predetermined set value of the machining depth; and effecting the machining on the printed circuit board by controlling the feed of the tool in conformity with the amount of relative movement.

Method of and apparatus for machining printed circuit board

An apparatus and method for supplying a printed circuit board to a printed circuit board drilling machine and for returning the printed circuit board after the drilling. A stocker stores a plurality of printed circuit boards in a tilted state, and a plurality of conveyor rollers provides a conveying path for the printed circuit boards. A conveyor device which includes conveyor rollers provides a conveying path connected to the first mentioned conveying path. The arrival of the printed circuit board is detected at a predetermined position, and the printed circuit board is then decelerated by braking in response to a signal from the detection. A device is provided on the printed circuit board drilling machine for delivering the printed circuit board to the printed circuit board drilling machine. A base plate can be provided with a pair of locating pins for being anchored to the drilling machine table and has the printed circuit board mounted thereon so that the drilling machine can handle one pattern and number of location pins regardless of the number and pattern of fixing pins on the printed circuit board.

Printed circuit board adapter supplying apparatus and method for use in

A spindle and Z-axis unit comprises a spindle housing and a hollow rotor shaft rotatable and axially movable with respect to the spindle housing. The rotor shaft carries a collet at its lower end for chucking a machine tool such as a drill bit. The tool is changed in the collet by pneumatic actuation of a diaphragm which actuates a push rod within the rotor shaft to move the collet axially against a spring bias to clamp and unclamp the tool. The shaft is moved in the Z-direction along with a thrust bearing assembly by a screw nut which actuates a road to move the rotor shaft in the Z-direction to drill a workpiece after a pressure foot has first been moved to clamp the workpiece with respect to the spindle. Thus, the moving weight or mass previously attributable to parts such as a spindle saddle and spindle housing can be eliminated without impairing the reliability and chucking force of the collet mechanism.

Low mass spindle and Z-axis unit

A spot facing method and apparatus for processing a printed circuit board incorporates a sensing device having a sensor probe capable of sensing the level of the surface of a printed circuit board, another sensing device for sensing the position of the end of a tool, measuring circuits for measuring the distance between the sensing probe and the end of the tool and the distance between the surface of the printed circuit board and the end of the tool in accordance with the signals from the sensing devices, and a controller connected to the measuring circuits so as to control the feed of the tool thereby attaining a high dimensional precision in the depthwise direction in the spot facing.

Spot facing method and apparatus for printed circuit board

A printed circuit board boring machine bores printed circuit boards stacked on a table, by a drill while pressing the printed circuit boards with a pressure foot. A piece having a hole through which the drill may pass is detachably mounted on a tip end portion of the pressure foot with a center of the hole being aligned with an axis of the drill. The piece may be attached to the pressure foot before the boring work so that the boards and the piece may be simultaneously bored by the drill while the hole in the piece may be used as a guide for the boring work of the boards.

Printed circuit board boring machine

A spindle and Z-axis unit comprises a spindle housing and a hollow rotor shaft rotatable and axially movable with respect to the spindle housing. The rotor shaft carries a collet at its lower end for chucking a machine tool such as a drill bit. The tool is changed in the collet by pneumatic actuation of a diaphragm which actuates a push rod within the rotor shaft to move the collect axially against a spring bias to clamp and unclamp the tool. The shaft is moved in the Z-direction along with a thrust bearing assembly by a screw nut which actuates a road to move the rotor shaft in the Z-direction to drill a workpiece after a pressure foot has first been moved to clamp the workpiece with respect to the spindle. Thus, the moving weight or mass previously attributable to parts such as a spindle saddle and spindle housing can be eliminated without impairing the reliability and chucking force of the collet mechanism.

In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

Growing community of inventors

Machida, Japan

Yasuhiko Kanaya