Ngk Spark Plug Company, Limited

Yasuhiko Inui

Manabu Sato

Jun Otsuka

Seiji Ichiyanagi

Takamichi Ogawa

Hiroshi Yamamoto

Akifumi Tosa

Toshitake Seki

Kaname Miwa

Jun Kurano

Hironobu Ishikawa

Yosuke Shinozaki

Taichi Kibe

A multilayer heating body () includes a ceramic substrate (), an electrode (), heaters (), terminals (), and an electricity supply path (). Through vias which constitute the electricity supply path include at least one combination of through vias &#x3b1;, &#x3b2;, &#x3b3;, and &#x3b4; which meets the following conditions (1) and (2). Condition (1): when the ceramic substrate is viewed from the front surface (3) side toward the back surface (3) side, the through via &#x3b4; is located at a position where the through via &#x3b4; overlaps the through via &#x3b2;, or in the vicinity of the through via &#x3b2;. Condition (2): when the ceramic substrate is viewed from the front surface side toward the back surface side, the through via &#x3b3; is located at a position between the through via &#x3b1; and the through via &#x3b4;, or located at a position where the through via &#x3b3; overlaps the through via &#x3b1;, or in the vicinity of the through via &#x3b1;.

Multilayer heating body

A heating member includes a ceramic substrate having a structure in which a plurality of ceramic layers are laminated together; a resistance heat-generating element embedded in the ceramic substrate; an electricity supply element disposed on a surface of the ceramic substrate; and an electricity supply path embedded in the ceramic substrate and electrically connecting the resistance heat-generating element and the electricity supply element. The electricity supply path includes a plurality of conductive layers disposed along the planar direction of the ceramic layers at different positions in the thickness direction of the ceramic substrate, and a plurality of vias disposed along the thickness direction of the ceramic substrate. When the plurality of conductive layers are viewed from the thickness direction, their outer edges are positionally offset from one another.

Heating member, electrostatic chuck, and ceramic heater

A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 &#x3bc;m, the dielectric layer has a thickness of from 0.3 to 5 &#x3bc;m, and the conductor layer has a thickness of from 0.3 to 10 &#x3bc;m. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 &#x3bc;m, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 &#x3bc;m, and a minimum via pitch is from 100 to 350 &#x3bc;m.

Method of manufacturing a dielectric structure

Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure

In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and formed by a plurality of interlayer insulating layers; and a plurality of conductor layers alternately laminated on the core board. The capacitor is of a chip-like shape with first and second main surfaces and includes a dielectric layer; electrode layers laminated on the dielectric layer; and a hole portion opening at least at the second main surface. The capacitor is embedded in the interlayer insulating layers so that the second main surface faces the core board.

Built-in capacitor type wiring board and method for manufacturing the same

Growing community of inventors

Kani, Japan

Yasuhiko Inui