Matsushita Electric Industrial Co., Ltd.

Yasuhiko Horio

Takayuki Takeuchi

Masumi Hattori

Masahide Tsukamoto

Hiroyuki Hase

Toru Ishida

Akihito Hatakeyama

Yoshihiro Bessho

Tamao Kojima

Toshio Tsuda

Hiroshi Sogo

Yasushi Fukumura

Seiichi Nakatani

Eiji Fujii

Masaki Aoki

Hideo Torii

Hiroshi Kawano

Ryoichi Takayama

Munenori Fujimura

Shuichiro Yamaguchi

Atsushi Tomozawa

Kouji Kawakita

Hiromi Tokunaga

Kengo Shiiba

Yasuharu Kikuchi

Hitoshi Uchi

Ken Kamata

Tatsurou Kikuchi

A non-reciprocal circuit device has a length, a width, and a thickness denoted respectively by LLand Land the overall dimensions of 2.5 mm&#x3c;L&#x3c;7.0 mm, 2.5 mm&#x3c;L&#x3c;7.0 mm, and 1.0 mm&#x3c;L&#x3c;3.5 mm. When a projected area of the substrate of the device is orthogonally projected on a plane parallel to a base surface of the substrate is denoted by S, the substrate holds a proportional relation to S/(L&#xd7;L)=0.1 to 0.78. When a thickness of the magnet of the device is denoted by Lthe magnet holds a proportional relation of L/L=0.2 to 0.5. When a projected area of the magnet orthogonally formed on a plane parallel to a surface of the magnet is denoted by Sthey have a proportional relation of S/S=0.15 to 0.83.

Non-reciprocal circuit device, method of manufacturing, and mobile communication apparatus using the same

A non-reciprocal circuit element for transmitting a signal in one way or cyclically transmitting the signal by using circuit means having at least a ferrite ( ), transmission lines ( and ), and a capacitor ( ), has at least two external input/output terminals ( and ) for transferring a signal to and from an external unit and at least one of external grounding terminals ( and ) for grounding, wherein at least one ( ) of the external grounding terminals is set between at least one set of the external input/output terminals ( and ).

Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit

Non-reciprocal circuit element having a grounding land between input/output patterns

A non-reciprocal circuit element for transmitting a signal in one way or cyclically transmitting the signal by using circuit means having at least a ferrite ( ), transmission lines ( , and ), and a capacitor ( ), and has at least two external input/output terminals ( and ) for transferring a signal to and from an external unit and at least one of external grounding terminals ( , and ) for grounding, wherein at least one ( ) of the external grounding terminals is set between at least one set of the external input/output terminals ( and ).

Non-reciprocal circuit element with ground terminals on one side free of input/output terminals

A surface wave filter element includes a portion on which elastic surface waves propagate. This portion includes a piezoelectric material, an amorphous boron layer or plate and IDT electrodes for inputting and outputting signals. The piezoelectric material is a film made of ZnO, LiNbO.sub.3 or LiTaO.sub.3 formed by sputtering, ion beam deposition or chemical vapor deposition. The amorphous boron layer or boron plate may be formed on a substrate made of an inorganic material. The boron material is formed using electron beam deposition, ion beam deposition or chemical vapor deposition.

Surface wave filter element

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

Method of manufacturing organic substrate used for printed circuits

A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.

Two-sided printed circuit board a multi-layered printed circuit board

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

Porous substrate and conductive ink filled vias for printed circuits

A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

Method of forming an electrical contact bump

A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

Electrical contact bump and a package provided with the same

The present invention relates to a base metal conductor multilayered substrate capable of being integral with thick film components such as thick film resistors and to a method for producing such substrate.

Multilayer ceramic substrate and method of making the same

Growing community of inventors

Osaka, Japan

Yasuhiko Horio