Fujitsu Component Limited

Yasuhiko Furuno

Osamu Daikuhara

Toshihiro Kusagaya

Hideo Miyazawa

Koichi Kiryu

Yasuyuki Miki

Tohru Yamakami

Shigeyuki Takizawa

Noboru Shimizu

An optical waveguide member including a first cladding section, a second cladding section joined to the first cladding section, and core sections formed between the first and second cladding sections. The first cladding section includes a major portion including a first surface and an opposite second surface, and an auxiliary portion formed along one side edge and including a reflecting surface. The core sections includes a first set of core sections formed along a plurality of grooves provided on the first surface of the first cladding section, and a second set of core sections formed along a plurality of grooves provided on the second surface of the first cladding section. Both of light propagating through the first set of core sections and light propagating through the second set of core sections are reflected at right angle by the reflecting surface and propagate through the auxiliary portion of the first cladding section.

Optical waveguide member, optical waveguide assembly, and optical module

A transceiver module for mounting to an information processing apparatus is disclosed. The transceiver module includes a housing including a cover part provided at a front side of the transceiver module, a data transmission/reception part mounted to the housing, the data transmission/reception part, a connector installed in the cover part of the housing, and a latch mechanism including an engagement pawl part engaged with the housing, the engagement pawl part including a first cam part, a spring member urging from the housing and abutting the engagement pawl part in a first width direction of the transceiver module, and a pull sleeve having a second cam part for pressing against the first cam part when the pull sleeve is pulled in a longitudinal direction of the transceiver module.

Transceiver module

A connector is disclosed that includes a housing and a module assembly disposed inside the housing. The module assembly includes a semiconductor element, a light receiving element, a light emitting element, a positioning plate in which a positioning hole is formed, a three-dimensional optical path component mounted on the positioning plate, and a printed circuit board on which the semiconductor element and the positioning plate are mounted. The three-dimensional optical path component includes a positioning pin and a projection. The light receiving element and the light emitting element are mounted on the positioning plate. The three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts an upper face of the positioning plate.

Connector

Growing community of inventors

Shinagawa, Japan

Yasuhiko Furuno