Seiko Epson Corporation

Yasuhiko Asano

Takuya Miyakawa

Yoshiaki Mori

Osamu Kurashina

Yohei Kurashima

Makoto Anan

Satoshi Miyamori

Takeshi Miyashita

Takayuki Hayashi

Toru Igarashi

Ichiro Aoyama

Yoshio Oda

Makoto Ishida

Shintaro Dobashi

Yasutugu Aoki

Hiroyuki Miyano

Isao Kubota

A robot system includes a first robot and a second robot, and the second robot has a base, a shaft provided translationally along an axis direction of a first axis on the base, and an arm provided rotatably with respect to the shaft, and the first robot can perform work on a work object that can be carried by the second robot.

Robot system

Provided herein is a functional liquid supply apparatus having: a plurality of sub tanks, a tank unit which replenishes the functional liquid to the plurality of sub tanks, an upstream side functional liquid channel of which an upstream side thereof is connected to the tank unit and a downstream side thereof is connected to each of the sub tanks, and a plurality of third opening and closing valves which replenish the functional liquid to each of the sub tanks by its' opening and closing operations. The tank unithas a pair of main tanks, nitrogen gas supply units connected to the pair of the main tanks respectively, and a switching device which is capable of switching a pressurized liquid of the functional liquid fed from the pair of the main tanks alternatively.

Functional liquid supply apparatus, liquid droplet ejection apparatus, method of manufacturing electro-optical apparatus, electro-optical apparatus and electronic apparatus

High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.

Method and apparatus for bonding using brazing material

Surface treatment apparatus

Growing community of inventors

Chino, Japan

Yasuhiko Asano