Tokyo Ohka Kogyo Co., Ltd.

Daicel Corporation

Yasuhide Ohuchi

Dai Shiota

Tatsuro Ishikawa

Toshimasa Nakayama

Hidekatsu Kohara

Ken Miyagi

Kunihiro Noda

Kousuke Doi

Hiroki Chisaka

Yasuyuki Akai

Naozumi Matsumoto

Mayumi Kuroko

Atsuko Hirata

Yukitsugu Maeda

Takafumi Imoto

Kouhei Fujita

A coloring agent dispersion which contains a satisfactorily dispersed pigment, and results in a photosensitive resin composition capable of forming a cured film when mixed in the photosensitive resin composition; a photosensitive resin composition containing the coloring agent dispersion; a cured product of the composition; an organic EL element provided with the cured product; a method for forming a pattern using the composition; and a method for producing a photosensitive resin composition using the dispersion. In a coloring agent dispersion including a coloring agent which contains a pigment and a dispersant, a dispersant containing a silsesquioxane compound of a specific structure is used.

Coloring agent dispersion, photosensitive resin composition, cured product, organic el element, method for forming pattern, and method for producing photosensitive resin composition

A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method

A phenol novolak resin has a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a resin structure not substantially varying in each molecular weight fraction and has a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene, which peak intensity ratio is detected byC-NMR analysis. The phenol novolak resin can form both dense pattern and isolation pattern with good shapes in the formation of a fine resist pattern of not more than 0.35 &#x3bc;m and has satisfactory sensitivity, definition, and focal depth range properties, and has a resin composition being uniform in each molecular weight fraction. A process for producing the phenol novolak resin, and a positive photoresist composition using the resin are also provided.

Phenol novolak resin, production process thereof, and positive photoresist composition using the same

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Kawasaki, Japan

Yasuhide Ohuchi