Seiko Epson Corporation

Yasuhide Matsuo

Kenji Otsuka

Kei Tadachi

Hiroyuki Tsuchiya

Kosuke Wakamatsu

Kazuo Higuchi

Wataru Takahashi

Minehiro Imamura

Tomohiro Hayashi

Yasunori Koike

Shintaro Asuke

Sukenori Ichikawa

Hiroo Miyajima

An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

Electronic device, liquid ejection head, and method of manufacturing electronic device

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

Provided is a liquid ejecting head including: a first substrate in which a space serving as a flow path is formed in a state of having an opening on a surface of one side thereof; and a second substrate which seals the opening from the surface on the one side of the first substrate, divides the flow path, and is made of resin, in which the first substrate and the second substrate adhere to each other via a first adhesive layer which is laminated on the surface on the one side of the first substrate and which is made of a silicone-based adhesive and a second adhesive layer which is laminated on the first adhesive layer and which is made of an epoxy-based adhesive.

Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head

A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

Method for manufacturing MEMS device, MEMS device, liquid ejecting head, and liquid ejecting apparatus

A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si&#x2014;O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together.

Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus

A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si&#x2014;O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.

Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device

A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si&#x2014;O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.

Droplet ejection head and droplet ejection apparatus

A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si&#x2014;O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.

The present invention provides a member comprising a substrate, an undercoat film formed on a surface of the substrate, and a liquid-repellent film of metal alkoxide formed on a surface of the undercoat film. Also disclosed are nozzle head, liquid-jet head and liquid-jet device employing the above-described member.

Growing community of inventors

Matsumoto, Japan

Yasuhide Matsuo