Fujitsu Corporation

Yasuhide Kuroda

Kenichiro Tsubone

Kazuhiro Suzuki

Takatoshi Yagisawa

Masakazu Kishi

Yuji Miyaki

Satoru Yamada

Shigeichi Izumi

Yoshinori Nakane

Tsuyoshi Yamamoto

Tadashi Ikeuchi

Tetsuya Kiyonaga

Naoaki Nakamura

Tszshing Cheung

Yasuhiro Ichihara

Rie Takada

Makoto Totani

Harumi Yagi

Takayoshi Tanemura

Masaki Ono

A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Heat sink device and method of repairing semiconductor device

A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.

Coaxial connector, connector assembly, printed circuit board and electronic apparatus

A coil package which makes it easy to handle a high-frequency cone/pyramid-shaped coil and enhance frequency characteristics without degrading the characteristics of the coil. The cone/pyramid-shaped coil has a conical or pyramidal shape formed by wiring a conductor wire around an outer peripheral surface of a core such that the winding diameter of the coil progressively decreases from one end to the other end of the coil. The coil and a dielectric substrate are integrated with each other by forming a hole for inserting a tip portion of the coil in the dielectric substrate, making the bottom of the hole and a back surface of the dielectric substrate electrically continuous by a via, placing the coil in the hole by directing a small-diameter side of the cone/pyramid-shaped coil to the hole, electrically connecting the bottom of the hole and a tip-side lead wire extending from the coil to each other, and connecting an electrode on a large-diameter side of the coil to an electrode on the dielectric substrate.

Coil package and bias tee package

In a circuit, as the bridge resistance of one side of a Wheatstone bridge circuit, a distortion gauge (fixed reference resistance) of which variation caused by environmental conditions is suppressed and a sample having a resistance component &#x394;R varied by the environmental conditions are connected in series. A constant bridge input voltage Ei is applied from a constant-voltage power supply to the Wheatstone bridge circuit, a bridge output voltage Eo corresponding to resistance variation of the sample is input to a dynamic distortion amplifier, and a carrier wave signal of a predetermined frequency is output. A measured resistance computing unit samples peak levels of the carrier wave signal output from the dynamic distortion amplifier so as to detect the bridge output voltage Eo, and calculates the resistance of the sample based on the detected bridge output voltage.

Sample resistance measurement device

An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Optical module

A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.

Receptacle type optical transmitter and/or receiver module

An optical module which can achieve miniaturization, high performance and cost reduction is provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Optical Module

An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.

Growing community of inventors

Kawasaki, Japan

Yasuhide Kuroda