Fujikoshi Machinery Corp.

Fujikoshi Kikai Kogyo Kabushiki Kaisha

Fujikoshi Kikai Kogyo Kabushiki

Yasuhide Denda

Yoshio Nakamura

Makoto Nakajima

Tsuyoshi Hasegawa

Yoshinobu Nishimoto

Norihiko Moriya

Atsushi Kajikura

Toshiaki Seki

Masahiro Takeuchi

Satoru Arakawa

Yoshio Otsuka

Satoru Kitta

Satoki Kanda

Chihiro Miyagawa

Masanori Furukawa

Haruo Sumizawa

Toshihisa Yanagisawa

Masanori Fukushima

Mitsue Ogawa

Kiyokazu Gonda

Takuya Kakegawa

Fuminari Kotagiri

Hisato Kuroiwa

The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

Method and device for cleaning abrasive plates on an abrasive machine

Method of cleaning abrasive plates of abrasive machine and cleaning device

Work piece feeding machine capable of correctly and efficiently setting a work piece in a through-hole of a carrier. The machine includes a positioning unit which detects the amount of displacement of the work piece with respect to the through-hole and corrects the position of the work piece in the though-hole. The positioning unit includes: a lighting source provided on the work piece side or the carrier side and directing polarized light on the work piece and the carrier; a camera provided on the carrier side or the work piece side and receiving the polarized light from the lighting source so as to catch images of an out edge of the work piece and an inner edge of the through-hole in a visual field thereof; and an image processor which measures the amount of displacement on the basis of positions of the outer edge and the inner edge.

Work piece feeding machine

Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first position above the polishing cloth and a second position outside of the polishing cloth. A jet nozzle is attached to the arm and directs high pressure water toward the polishing cloth. An enclosing member encloses the jet nozzle so as to prevent the high pressure water, which has been directed out from the jet nozzle, from scattering. The jet nozzle is oriented toward the center roller and the high pressure water is directed toward the part of the polishing cloth in the vicinity of the center roller when the arm moves the jet nozzle close to the center roller.

Cloth cleaning device and polishing machine

The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding unit for holding a work piece. In the holding unit, an inner head has a first concave section. An outer head has a second concave section. A holding plate is provided in the first concave section. An elastic holding member forms a first chamber. An outer enclosing member is provided to the outer head. An inner enclosing member is provided between the outer enclosing member and the inner head. A pressing member presses the abrasive face of the abrasive plate and encloses the holding plate. An elastic ring member a second chamber. A pressurizing unit pressurizes the chambers so as to press the work piece and the pressing member onto the abrasive face.

Abrasive machine

The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Disk edge polishing machine and disk edge polishing system

The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.

Polishing machine

In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

Polishing system for polishing wafer

Growing community of inventors

Nagano, Japan

Yasuhide Denda