Nippon Steel Chemical Co., Ltd.

Yasuharu Yamada

Nobuyuki Furukawa

Masashi Kaji

Masaya Furukawa

Takanori Aramaki

Norito Nakahara

Tadashi Komoto

Hidehiko Koishi

This invention relates to naphthol aralkyl resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15 and cured products thereof, which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.

Naphthol aralkyl resins and cured products thereof

Polyimide copolymers of this invention have a repeating unit of the general formula (1) ##STR1## wherein Ar.sub.1 is a tetravalent organic radical containing at least one aromatic ring, R.sub.1 is a divalent organic radical, R.sub.2 and R.sub.3 are monovalent hydrocarbon radicals, and n is an integer from 0 to 4 and a repeating unit of the general formula (2) ##STR2## wherein Ar.sub.2 is a tetravalent organic radical containing at least one aromatic ring, R.sub.6 is a divalent organic radical, R.sub.7 is a monovalent hydrocarbon radical with 1 to 6 carbon atoms, and l is an integer from 5 to 50 and are capable of forming films of a microdomain structure useful for such applications as protective films on semiconductors, coatings adhesives, moldings, films, and separation membranes.

Polyimide copolymers and process for preparing the same

The invention relates to naphthol-based epoxy resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15, naphthol aralkyl resins which are intermediates for said epoxy resins, a process for the preparation of said naphthol aralkyl resins, and epoxy resin compositions containing said naphthol-based epoxy resins which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.

Naphthol-based epoxy resins, intermediates for the same, process for

Polyimide-based separation membranes of this invention are made from polyimides having repeating units of the general formulas (A) and (B) ##STR1## wherein Ar.sub.1 and Ar.sub.3 are tetravalent aromatic radicals containing at least one aromatic ring, Ar.sub.2 is a divalent aromatic radical containing at least one aromatic ring, R.sub.1 and R.sub.2 are organic radicals, R.sub.3 to R.sub.6 are monovalent hydrocarbon radicals, and n is an integer from 1 to 50 at a mole ratio (A)/(B) of 5/95 to 95/5, have high gas permeation coefficients, high mechanical strength, and excellent heat resistance, and are useful for separation and concentration of mixed gases.

Separation membranes and process for preparing the same

Silicon-modified polyimides of this invention containing a basic structure of the general formula (1) ##STR1## in which R and R' are hydrogen or alkyl, B is the amineless residue of a diamine, and X is divalent radical ##STR2## in which R.sub.1 to R.sub.4 are monovalent hydrocarbon groups with 1 to 6 carbon atoms show excellent heat resistance and solubility in various solvents and are useful for films for orientation of LCD's, junction coating resins for diodes, passivation films for IC's and LSI's, and alpha ray shielding films for VLSI's.

Growing community of inventors

Kitakyushu, Japan

Yasuharu Yamada