Tokyo Electron Limited

Intel Corporation

Yasuharu Iwashita

Takeshi Tamura

Osamu Hirakawa

Akira Fukutomi

Masataka Matsunaga

Masaaki Umitsuki

Xavier Francois Brun

Naoto Yoshitaka

Masaru Honda

Kazutoshi Ishimaru

Takahiro Masunaga

Charles Wayne Singleton, Jr

Takahiro Nishibayashi

Takashi Koga

Shingo Katsuki

Eiji Manabe

Tatsuya Kitayama

Kazutaka Noda

Yasutaka Soma

Fumio Sakata

Ichiro Shimomura

A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Substrate transfer device and bonding system

Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.

Substrate conveyance apparatus and substrate peeling system

Disclosed is a peeling system which includes a peeling device, a plurality of first cleaning devices, an inversion device, a second cleaning device, and first to third conveyance devices. The peeling device is configured to separate a superimposed substrate into a first substrate and a second substrate. The plurality of first cleaning devices is configured to clean a bonded surface of the first substrate. The inversion device configured to invert front and rear surfaces of the first substrate. The second cleaning device is configured to clean a non-bonded surface of the first substrate. Delivery positions of the first substrate in the plurality of first cleaning devices are arranged in a region where an operation range of the first conveyance device and an operation range of the second conveyance device overlap each other.

Peeling system

In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Substrate holding apparatus and substrate holding method

A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus. The pressure inside a transport apparatus is a positive pressure in relation to the pressure inside the peeling device and the pressure inside the first washing apparatus.

Peeling system, peeling method, and computer storage medium

According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Substrate inverting device, substrate inverting method, and peeling system

A joint system includes: a transfer-in/out station capable of holding a plurality of substrates or a plurality of superposed substrates, and transferring-in/out the substrates or superposed substrates to/from a processing station; and the processing station performing predetermined processing on the substrates and joining the substrates together. The processing station includes: a surface activation apparatus activating a front surface of the substrate; a surface hydrophilizing apparatus hydrophilizing and cleaning the front surface of the substrate; a joint apparatus joining the substrates together; and a transfer region for transferring the substrate or superposed substrate to the surface activation apparatus, the surface hydrophilizing apparatus, and the joint apparatus.

Joint system, joint method, program and computer storage medium

The present invention includes a first and a second optical path forming member arranged within a path of light beams from a light source; a first mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the first optical path forming member, and a second mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the second optical path forming member, each of the mounting tables being configured to be rotatable about a vertical axis while mounting the substrate thereon; and a light blocking means for blocking application of light from each of the first and second optical path forming members. A common light source can be used to perform edge exposure for the substrates on the first and second mounting tables, for example, at the same time, so that a high processing ability can be offered and an increase in size of the apparatus can be prevented.

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Koshi, Japan

Yasuharu Iwashita