Shin-etsu Handotai Co., Ltd.

Shin-etsu Engineering Co., Ltd.

Yasuharu Ariga

Hiromasa Hashimoto

Takahiro Matsuda

Hisashi Masumura

Masanao Sasaki

Kouzi Kitagawa

Toshimasa Kubota

A method of producing a polishing head including: a backing pad, for holding a workpiece back surface, stuck on a lower portion of a rigid body; and a ring template, for holding a workpiece edge, disposed on a lower surface of the backing pad. This polishing head brings a front surface of the workpiece into sliding contact with a polishing pad attached on a turn table while holding the workpiece back surface on the lower surface of the backing pad. The method includes sticking the backing pad on the lower portion of the rigid body with a double-sided tape under a reduced pressure without heating; and sticking the template on the backing pad with a double-sided tape or a liquid or paste reaction curable adhesive containing no solvent under a reduced pressure without heating. This method can polish the workpiece into a very flat workpiece.

Method of producing polishing head and polishing apparatus

The present invention provides a polishing headcomprising a carrier, a guide ring, a dress ring, and a head body, wherein the head bodyis rotatable, and holds the carrier, the guide ring, and the dress ring; the head bodyhas a reversed-bowl shape and has a hollow; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanismcommunicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing padon a turn tablewith rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

Polishing head, polishing apparatus and polishing method for semiconductor wafer

There is provided a cutting method comprising winding a wire around plural grooved rollers, and pressing the wire against the work with running it, to cut the work, wherein the work is cut with controlling temperature of the work by supplying a cutting fluid containing abrasive grains to the grooved rollers, and supplying a temperature controlling medium to the work and a wire saw. Thereby, influence of the heat generated during cutting process of the work is controlled, and a relative shift of the work and the wire can be suppressed, a level of a warp of a wafer and a local warp can be improved, and flatness in a polishing step can be improved.

Wire saw and cutting method

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Nishigo-mura, Japan

Yasuharu Ariga