Denso Corporation

Yasufumi Matsuo

Masashi Yamasaki

Shuhei Miyachi

Toshio Tsutsui

Tatsuya Abe

Koji Matsuo

A rear frame has a plurality of engaging portions engaged with connection members. An engagement surface of the specific engaging portion which is a part of the plurality of engaging portions is in a state in which the connection member is in contact with the connection member, and the material of the rear frame is exposed. Among the plurality of engaging portions, the other engaging portion other than the specific engaging portion and the outer wall portion of the rear frame exposed to the outside space have a coating.

Drive device

A connector unit of a drive device includes an electric power supply connector, a signal connector, a base portion and leg portions and is fixed to an opposite side of a heat sink, which is opposite from an electric motor. The leg portions are formed at an outer peripheral edge of the base portion. A cover member receives the connector unit and the heat sink in the state where the electric power supply connector and the signal connector are exposed from the cover member. A connector side O-ring is installed between the base portion and the cover member. A height position of a first end surface of each leg portion is on a first side of a second base end surface of the base portion. With this construction, it is possible to limit deterioration of waterproofness of the drive device caused by a thermal load.

In a driver device, a controller substrate has a center part on which a rotation angle sensor is attached and an outer periphery portion which is fixed onto a heat sink. The heat sink has a cylinder part extending in an axial direction of the rotation shaft to contact the outer periphery portion of the controller substrate. The cylinder part of the heat sink is continuously formed along an entire periphery and has the same height at all portions. Such configuration provides an even deformation distribution of the cylinder part due to a temperature change, thereby reducing unevenness of heat stress distribution along a substrate plane and decreasing stress applied to the sensor, which facilitates a reduction of a detection error of the sensor.

Growing community of inventors

Kariya, Japan

Yasufumi Matsuo