Taiyo Yuden Co., Ltd.

Fujitsu Media Devices Limited

Fujitsu Corporation

Skyworks Solutions, Inc.

Skyworks Global Pte. Ltd.

Yasufumi Kaneda

Osamu Kawachi

Yiliu Wang

Kaoru Sakinada

Masanori Ueda

Motoyuki Tajima

Shunichi Aikawa

Tomoya Komatsu

Takuma Kuroyanagi

Akira Moriya

Takumi Kooriike

Takuya Abe

Takashi Matsuda

Jun Tsutsumi

Stephane Richard Marie Wloczysiak

Shogo Inoue

Takashi Yamashita

Michio Miura

Osamu Ikata

Kwang Jae Shin

Jiansong Liu

Seiichi Mitobe

Takayuki Yamaji

Suguru Warashina

Nan Wu

Kazushige Hatakeyama

Hitoshi Tsukidate

Kenya Hashimoto

Masatsune Yamaguchi

Xianyi Li

Tatsuya Omori

Tooru Takezaki

Kouta Ohkubo

Yoshinori Kondou

Kouta Ookubo

Aspects of this disclosure relate to an acoustic wave resonator having at least two resonant frequencies. An acoustic wave filter can include series acoustic wave resonators and shunt acoustic wave resonators together arranged to filter a radio frequency signal. A first shunt resonator of the shunt acoustic wave resonators can include an interdigital transducer electrode and have at least a first resonant frequency and a second resonant frequency. Related acoustic wave resonators, multiplexers, wireless devices, and methods are disclosed.

Acoustic wave resonator with multiple resonant frequencies

A ladder filter comprises a plurality of series arm bulk acoustic wave resonators electrically connected in series between an input port and an output port of the ladder filter and a plurality of shunt bulk acoustic wave resonators electrically connected in parallel between adjacent ones of the plurality of series arm bulk acoustic wave resonators and ground, at least one of the plurality of shunt bulk acoustic wave resonators including raised frame regions having a first width, at least one of the plurality of series arm bulk acoustic wave resonators having one of raised frame regions having a second width less than the first width or lacking raised frame regions.

Bulk acoustic wave/film bulk acoustic wave resonator and filter for wide bandwidth applications

Acoustic wave filter with shunt resonator having multiple resonant frequencies

An acoustic wave device includes: a substrate; an acoustic wave resonator that is formed on the substrate; a first wiring line that is formed on the substrate and is electrically coupled to the acoustic wave resonator; and a second wiring line that is electrically coupled to the first wiring line, at least a part of the second wiring line being formed immediately above the acoustic wave resonator across an air gap.

Acoustic wave device

Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap.

Acoustic wave device, filter, and duplexer

An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

Electronic component and method of manufacturing the same

There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90&#xb0; with the solder melted.

Electronic device and method of fabricating the same

A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.

Balance filter comprising two acoustic wave filters connected to a single ground terminal

An acoustic wave filter includes a piezoelectric substrate, an IDT (interdigital transducer) formed on the piezoelectric substrate, and reflectors located at both sides of the IDT and composed of electrode fingers, at least one of the electrode fingers of at least one of the reflectors including at least one gap within a propagation path of an acoustic wave.

Acoustic wave filter comprising a reflector having an oblique slit

An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

A filter includes a first filter that is connected between an input node and an output node and is a surface acoustic wave filter, and a second filter that is provided between the input node and the output node and is connected in parallel with the first filter. The first filter has a total number N1 of pairs of electrode fingers of interdigital transducers and the second filter having a total number N2 of pairs of electrode fingers of interdigital transducers, in which N1 is greater than N2.

Filter having multiple surface acoustic wave filters connected in parallel

A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.

Downsized package for electric wave device

A balanced filter includes a package having an input ground metal pattern and an output ground metal pattern, and a filter chip having an inphase filter and an antiphase filter, which filters are mounted on the package, at least one of the inphase and antiphase filters having an input ground terminal connected to the input ground metal pattern and an output ground terminal connected to the output ground metal pattern, the input and output ground terminals of said at least one of the inphase and antiphase filters being separate from each other on the filter chip.

Balanced output filter having specified package input and output ground metal patterns

A surface acoustic wave device for implementing an attenuation characteristic outside of the pass band and the narrow band characteristics, preferably for use as a filter. The surface acoustic wave device includes a piezoelectric substrate, interdigital transducers formed on the piezoelectric substrate, and first and second reflectors disposed on the sides of the interdigital transducers. Each of the first and second reflectors includes an open electrode block with a plurality of electrically independent electrode fingers, and a short electrode block with a plurality of electrode fingers of which both ends are electrically shorted.

Surface acoustic wave device having reflectors with both open and shorted electrodes

Growing community of inventors

Yokohama, Japan

Yasufumi Kaneda