Koito Manufacturing Company, Ltd.

Shinko Electric Industries Co., Ltd.

Yasuaki Tsutsumi

Hisayoshi Daicho

Masanobu Mizuno

Takaaki Komatsu

Yasutaka Sasaki

Hitoshi Takeda

Yoshinori Shibata

Yoshiro Ito

Shogo Sugimori

Takeshi Iwasaki

Tomoaki Harada

Honami Fujii

Takayoshi Ishizuka

Hidekazu Hayama

Masaru Kaneko

Masayuki Kobayashi

Kazuhisa Inoue

Yosuke Ohashi

Takashi Onishi

Mitsutoshi Higashi

Akinori Shiraishi

Takeshi Masuda

Kenji Yamada

Masaaki Nakabayashi

Tatsuya Matsuura

Daisuke Mochizuki

Hiroaki Hara

Naoki Sone

Hideaki Yamamoto

Yuki Takahashi

Yuji Higashi

Takenao Yoshimura

Kazuhiro Ito

Rie Arai

Nobuyuki Horikawa

Hirokazu Yamaguchi

A method for producing a vehicle rear module that includes: a clear member monolithically including a lamp section and a window section; and a colored member for shielding at least part of a vehicle interior from the exterior. The method for producing the vehicle rear module comprises: a step for injecting a transparent resin from a single resin injection hole into a first cavity to form the clear member; and a step for injecting a colored resin from a plurality of resin injection holes into a second cavity to form the colored member.

Method of manufacturing vehicle rear module, vehicle back door, vehicle rear module, and vehicle module

Problem: To enhance the accuracy of the information collected from around a vehicle by always keeping constant the relative positions of a plurality of sensors provided at different parts of a vehicle body. Means to Solve the Problem: In a front module panelprovided to the front surface of a vehicle body, a panel bodyis integrally molded by a synthetic resin material, a front grille portionis provided at the center thereof, a front bumper portionis formed below the grille portion, and a translucent cover portionof a head lampis two-color molded by a transparent resin material at each of both right ends of the panel body. A camera is built in each of the head lamps, a millimeter wave radaris mounted to an emblem, a LIDARis built in each fog lamp, and ultrasonic sensorsare disposed near the lower edge of the front bumper portion

Vehicle exterior panel provided with sensors

Provided is a display system for a vehicle. The display system includes a display device installed to be visually recognizable from the outside of a vehicle, and a control device configured to cause the display device to display state information of the vehicle. The control device receives a signal from a sensor that senses a distance from the vehicle to an object around the vehicle, and the control device changes display of the display device based on the distance.

Display system for vehicle

There is provided a production method of a resin composite module for a vehicle, which includes a resin module substrate, and a silicone-based polymer hard coat which is formed on the resin module substrate. The method includes forming the hard coat by coating a silicone-based polymer onto the resin module substrate, and radiating an ultraviolet ray onto at least a part of a surface of the hard coat such that a hardness thereof becomes 0.8 GPa or more as evaluated by a nanoindentation method. The radiating the ultraviolet ray uses a light source unit which includes a light source and emits an ultraviolet ray having a wavelength of 360 nm or less from an emission surface thereof and radiates the ultraviolet ray onto the surface of the hard coat while a distance from the emission surface to the surface of the hard coat is 10 mm or less.

Resin composite module for vehicle and production method therefor

A water heating device () includes an infrared light emitting diode () configured to emit a light beam in a wavelength band including a wavelength of 1.4 &#x3bc;m or more. With the application of an infrared light beam emitted from the infrared light emitting diode () toward an applied body (e.g., a front cover ()), at least a part of the infrared light beam is absorbed into water attached to the applied body to heat the water.

Water heating device and lamp using same

A light emitting module includes a board on which a plurality of light emitting devices are mounted, a first interconnecting section having first interconnections, one end of each of which being connected to one of an anode side and an cathode side of an associated one of the light emitting devices, a second interconnecting section having second interconnections, one end of each of which being connected to the other of the anode side and the cathode side of an associated one of the light emitting devices, and a power supply portion provided along one side of the board to receive an external power. The second interconnecting section has at least one, but less than the number of the second interconnections, collectively interconnecting portion to which another end of each of the second interconnections is connected.

Light emitting module and vehicle lamp

A light emitting apparatus includes LED chips and a light condenser condensing the light emitted from the LED chips. The light condenser has a first opening functioning as an incident part through which the light emitted from the LED chips enters, a side surface function as a reflector that reflects the light having entered through the first opening, and a second opening functioning as an emission part that emits the light reflected by the side surface. A phosphor layer, which converts the wavelength of the light emitted from the LED chips and emits the wavelength-converted light, is formed in the first opening. The light condenser is arranged such that the phosphor layer is located on the light emission surfaces of the LED chips.

Light emitting apparatus and automotive lamp

In a light emitting module, a light wavelength conversation ceramicconverts the wavelength of the light emitted by a semiconductor light emitting elementthen emits the light. An optical filtertransmits the blue light Lb mainly emitted by the semiconductor light emitting elementand reflects the yellow light Ly whose wavelength has been mainly converted by the light wavelength conversion ceramic. The optical filteris provided on the surface of the light wavelength conversion ceramic. The light emitting moduleis manufactured by: the process where the optical filteris provided on at least one surface of the light wavelength conversion ceramic; and the process where the semiconductor light emitting elementand the light wavelength conversion ceramicare arranged such that the light emitted by the semiconductor light emitting elementis incident into the light wavelength conversion ceramic

Light emitting module, method of manufacturing the light emitting module, and lamp unit

In a light wavelength conversion unit, a light wavelength conversion member is placed on the emission surface of a semiconductor light-emitting element. The light wavelength conversion member converts the wavelength of blue light, which has emitted from the semiconductor light-emitting element and entered from an incident surface, so as to emit yellow light and then emits the yellow light from an emission surface. A light reflection layer is provided on a lateral face in the surface of the light wavelength conversion member. Here, the lateral face excludes the incident surface and the emission surface. The light wavelength conversion member is roughened such that an average roughness Ra of the lateral face is 0.5 &#x3bc;m or above.

Light wavelength conversion unit

A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.

Light emitting device that includes wavelength conversion layer having outer peripheral portion having convex projecting part with light reflection layer formed thereon

In a light emission module (), a light wavelength conversion ceramic () is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element () when emitting the light. The light wavelength conversion ceramic () has a tapered plane () which is inclined to approach the semiconductor light emission element () toward the brim portion. The light wavelength conversion ceramic () is transparent and is arranged so that the light emission wavelength band after the conversion has an all ray permeability of 40% or above.

Light emission module, light emission module manufacturing method, and lamp unit

A light emitting module is provided with a light emitting element and an optical wavelength converting member. The optical wavelength converting member includes a light incident plane, a light output plane, and an outer plane which is a plane except for said light incident plane and said light output plane. The optical wavelength converting member converts a wavelength of light emitted on the light emitting element and entered from the light incident plane into the optical wavelength converting member and outputs the wavelength-converted light from the light output plane. An average roughness 'Ra' of at least a portion of the outer plane is lower than an average roughness of the light output plane.

Light emitting module and optical wavelength converting member

In a plate-shaped fluorescent member configured to convert the wavelength of the light emitted by a semiconductor light emitting element, the fluorescent member is formed of an inorganic material having a refractive index of 1.5 or more and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%. A concave portion is formed, of the surfaces of the fluorescent member, on the surface on the side where the light in the semiconductor light emitting element is mainly emitted. In the fluorescent member, the light transmittance of the light having a wavelength of 380 nm to 500 nm may be less than 20%. The concave portion may be a groove. The concave portion may be a plurality of holes that are scattered.

Fluorescent member and light emitting module

A light emitting module includes: an LED chip; a plate-shaped phosphor layer that is provided so as to face the light emitting surface of the LED chip and is configured to convert the wavelength of the light emitted by the LED chip; and a filter layer that is formed, of the surfaces of the phosphor layer, on at least one of the surface that faces the LED chip and the side surface, and that is configured to transmit the light emitted from the LED chip and to reflect the light whose wavelength has been converted by the phosphor layer. The filter layer is formed such that a ratio of the energy of the emitted light within a range of &#xb1;60&#xb0; with respect to the front direction to the total energy of emitted light is 80% or more.

Growing community of inventors

Shizuoka, Japan

Yasuaki Tsutsumi