Ist Corporation, Limited

Yasuaki Takeda

Koji Moriuchi

Nobuyuki Hama

A binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of an active substance is provided. The binder composition for electrodes includes at least one type of tetracarboxylic acid ester compound, at least one type of diamine compound, and an organic solvent. Furthermore, the organic solvent preferably has a boiling point that is 250&#xb0; C. or less. In addition, the organic solvent preferably has a highest occupied molecular orbital (HOMO) that is &#x2212;10 eV or less.

Binder composition for electrodes and electrode mix slurry

The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 &#x3bc;m&#x2dc;125 &#x3bc;m. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

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Otsu, Japan

Yasuaki Takeda